English
Mobileye Chooses Sonics SMART Interconnect as Foundation For New Automotive SoC
Deal Highlights Benefits of Outsourcing Complex SoC Design
MOUNTAIN VIEW, Calif., - January 10, 2005 – Sonics, Inc.®, the premier supplier of system-on-chip (SoC) SMART Interconnects™, today announces the selection of SonicsMX™ by Mobileye N.V., the leading provider of advanced driver assistance systems for the automotive industry, for design into that company’s second generation single-camera driving assistance SoC. Mobileye’s decision substantiates the effectiveness of SonicsMX for multimedia streaming applications, as well as the trend by electronics companies to outsource their complex SoC interconnect design for improved economics and time to market.
The need to consolidate many popular driver assistance applications, such as adaptive cruise control, lane departure warning, lane change assistance, forward collision warning, pedestrian detection, and traffic sign detection, onto a single SoC creates complexities when designing these types of devices. Additionally, the streaming nature and real-time processing aspects of multimedia SoCs, like those from Mobileye, require high performance and data bandwidth control. SonicsMX is designed to effectively control on-chip performance and data bandwidth.
“The SoCs we design have both ultra high-performance video processing and real-time data transactions that require a proven, efficient and reliable interconnect architecture structure,” says Elchanan Rushinek, vice president of engineering at Mobileye Vision Technologies, Mobileye's Israel-based R&D subsidiary. “The rich set of data flow services built into SonicsMX allows us to address the complex data flows associated with these extraordinarily difficult requirements more rapidly than attempting to design something equivalent by ourselves. By focusing our engineering efforts on architecture and system integration issues we can also significantly lower our development cost and time to market.”
The Mobileye SoC represents the first time a Sonics SMART Interconnect is being used in the automotive industry. The continued expansion of Sonics’ applications space also highlights the continuing transformation of the semiconductor industry towards a platform architecture approach, and Sonics as the catalyst for these industry changes.
About Sonics
Sonics, Inc. is the premier supplier of SMART Interconnects that deliver high SoC design predictability and increased design efficiency. Major semiconductor and systems companies including Broadcom, Samsung, Texas Instruments and Toshiba have applied Sonics’ SMART Interconnects in leading products in the wireless, digital multimedia and communications markets. Sonics is a privately-held company funded by Investar Capital, Smart Technology Ventures, TL Ventures, Easton Hunt Capital, JAFCO Ventures, and H&Q Asia-Pacific. For more information, see www.sonicsinc.com
MOUNTAIN VIEW, Calif., - January 10, 2005 – Sonics, Inc.®, the premier supplier of system-on-chip (SoC) SMART Interconnects™, today announces the selection of SonicsMX™ by Mobileye N.V., the leading provider of advanced driver assistance systems for the automotive industry, for design into that company’s second generation single-camera driving assistance SoC. Mobileye’s decision substantiates the effectiveness of SonicsMX for multimedia streaming applications, as well as the trend by electronics companies to outsource their complex SoC interconnect design for improved economics and time to market.
The need to consolidate many popular driver assistance applications, such as adaptive cruise control, lane departure warning, lane change assistance, forward collision warning, pedestrian detection, and traffic sign detection, onto a single SoC creates complexities when designing these types of devices. Additionally, the streaming nature and real-time processing aspects of multimedia SoCs, like those from Mobileye, require high performance and data bandwidth control. SonicsMX is designed to effectively control on-chip performance and data bandwidth.
“The SoCs we design have both ultra high-performance video processing and real-time data transactions that require a proven, efficient and reliable interconnect architecture structure,” says Elchanan Rushinek, vice president of engineering at Mobileye Vision Technologies, Mobileye's Israel-based R&D subsidiary. “The rich set of data flow services built into SonicsMX allows us to address the complex data flows associated with these extraordinarily difficult requirements more rapidly than attempting to design something equivalent by ourselves. By focusing our engineering efforts on architecture and system integration issues we can also significantly lower our development cost and time to market.”
The Mobileye SoC represents the first time a Sonics SMART Interconnect is being used in the automotive industry. The continued expansion of Sonics’ applications space also highlights the continuing transformation of the semiconductor industry towards a platform architecture approach, and Sonics as the catalyst for these industry changes.
About Sonics
Sonics, Inc. is the premier supplier of SMART Interconnects that deliver high SoC design predictability and increased design efficiency. Major semiconductor and systems companies including Broadcom, Samsung, Texas Instruments and Toshiba have applied Sonics’ SMART Interconnects in leading products in the wireless, digital multimedia and communications markets. Sonics is a privately-held company funded by Investar Capital, Smart Technology Ventures, TL Ventures, Easton Hunt Capital, JAFCO Ventures, and H&Q Asia-Pacific. For more information, see www.sonicsinc.com
|
||||||
Related News
- MIPS Technologies' 24K Core and Sonics' SiliconBackplane SMART Interconnect IP Provide a Fast-to-Market Digital Multimedia SOC Solution
- Sonics' SMART Interconnect IP Supports Greater SOC Complexity and Accelerates SOC Design Cycles
- APlabs Chooses CAST IP Cores for Next-Generation Automotive SoC
- Arteris IP FlexNoC Interconnect Again Licensed by AutoChips for Automotive SoC Product Line
- Arteris IP FlexNoC Interconnect Licensed by AutoChips for Automotive SoC Development
Breaking News
- Breker RISC-V SystemVIP Deployed across 15 Commercial RISC-V Projects for Advanced Core and SoC Verification
- Veriest Solutions Strengthens North American Presence at DVCon US 2025
- Intel in advanced talks to sell Altera to Silverlake
- Logic Fruit Technologies to Showcase Innovations at Embedded World Europe 2025
- S2C Teams Up with Arm, Xylon, and ZC Technology to Drive Software-Defined Vehicle Evolution
Most Popular
- Intel in advanced talks to sell Altera to Silverlake
- Arteris Revolutionizes Semiconductor Design with FlexGen - Smart Network-on-Chip IP Delivering Unprecedented Productivity Improvements and Quality of Results
- RaiderChip NPU for LLM at the Edge supports DeepSeek-R1 reasoning models
- YorChip announces Low latency 100G ULTRA Ethernet ready MAC/PCS IP for Edge AI
- AccelerComm® announces 5G NR NTN Physical Layer Solution that delivers over 6Gbps, 128 beams and 4,096 user connections per chipset
|
E-mail This Article | 
|
|
Printer-Friendly Page |