English
Mobileye Chooses Sonics SMART Interconnect as Foundation For New Automotive SoC
Deal Highlights Benefits of Outsourcing Complex SoC Design
MOUNTAIN VIEW, Calif., - January 10, 2005 – Sonics, Inc.®, the premier supplier of system-on-chip (SoC) SMART Interconnects™, today announces the selection of SonicsMX™ by Mobileye N.V., the leading provider of advanced driver assistance systems for the automotive industry, for design into that company’s second generation single-camera driving assistance SoC. Mobileye’s decision substantiates the effectiveness of SonicsMX for multimedia streaming applications, as well as the trend by electronics companies to outsource their complex SoC interconnect design for improved economics and time to market.
The need to consolidate many popular driver assistance applications, such as adaptive cruise control, lane departure warning, lane change assistance, forward collision warning, pedestrian detection, and traffic sign detection, onto a single SoC creates complexities when designing these types of devices. Additionally, the streaming nature and real-time processing aspects of multimedia SoCs, like those from Mobileye, require high performance and data bandwidth control. SonicsMX is designed to effectively control on-chip performance and data bandwidth.
“The SoCs we design have both ultra high-performance video processing and real-time data transactions that require a proven, efficient and reliable interconnect architecture structure,” says Elchanan Rushinek, vice president of engineering at Mobileye Vision Technologies, Mobileye's Israel-based R&D subsidiary. “The rich set of data flow services built into SonicsMX allows us to address the complex data flows associated with these extraordinarily difficult requirements more rapidly than attempting to design something equivalent by ourselves. By focusing our engineering efforts on architecture and system integration issues we can also significantly lower our development cost and time to market.”
The Mobileye SoC represents the first time a Sonics SMART Interconnect is being used in the automotive industry. The continued expansion of Sonics’ applications space also highlights the continuing transformation of the semiconductor industry towards a platform architecture approach, and Sonics as the catalyst for these industry changes.
About Sonics
Sonics, Inc. is the premier supplier of SMART Interconnects that deliver high SoC design predictability and increased design efficiency. Major semiconductor and systems companies including Broadcom, Samsung, Texas Instruments and Toshiba have applied Sonics’ SMART Interconnects in leading products in the wireless, digital multimedia and communications markets. Sonics is a privately-held company funded by Investar Capital, Smart Technology Ventures, TL Ventures, Easton Hunt Capital, JAFCO Ventures, and H&Q Asia-Pacific. For more information, see www.sonicsinc.com
MOUNTAIN VIEW, Calif., - January 10, 2005 – Sonics, Inc.®, the premier supplier of system-on-chip (SoC) SMART Interconnects™, today announces the selection of SonicsMX™ by Mobileye N.V., the leading provider of advanced driver assistance systems for the automotive industry, for design into that company’s second generation single-camera driving assistance SoC. Mobileye’s decision substantiates the effectiveness of SonicsMX for multimedia streaming applications, as well as the trend by electronics companies to outsource their complex SoC interconnect design for improved economics and time to market.
The need to consolidate many popular driver assistance applications, such as adaptive cruise control, lane departure warning, lane change assistance, forward collision warning, pedestrian detection, and traffic sign detection, onto a single SoC creates complexities when designing these types of devices. Additionally, the streaming nature and real-time processing aspects of multimedia SoCs, like those from Mobileye, require high performance and data bandwidth control. SonicsMX is designed to effectively control on-chip performance and data bandwidth.
“The SoCs we design have both ultra high-performance video processing and real-time data transactions that require a proven, efficient and reliable interconnect architecture structure,” says Elchanan Rushinek, vice president of engineering at Mobileye Vision Technologies, Mobileye's Israel-based R&D subsidiary. “The rich set of data flow services built into SonicsMX allows us to address the complex data flows associated with these extraordinarily difficult requirements more rapidly than attempting to design something equivalent by ourselves. By focusing our engineering efforts on architecture and system integration issues we can also significantly lower our development cost and time to market.”
The Mobileye SoC represents the first time a Sonics SMART Interconnect is being used in the automotive industry. The continued expansion of Sonics’ applications space also highlights the continuing transformation of the semiconductor industry towards a platform architecture approach, and Sonics as the catalyst for these industry changes.
About Sonics
Sonics, Inc. is the premier supplier of SMART Interconnects that deliver high SoC design predictability and increased design efficiency. Major semiconductor and systems companies including Broadcom, Samsung, Texas Instruments and Toshiba have applied Sonics’ SMART Interconnects in leading products in the wireless, digital multimedia and communications markets. Sonics is a privately-held company funded by Investar Capital, Smart Technology Ventures, TL Ventures, Easton Hunt Capital, JAFCO Ventures, and H&Q Asia-Pacific. For more information, see www.sonicsinc.com
|
||||||
Related News
- MIPS Technologies' 24K Core and Sonics' SiliconBackplane SMART Interconnect IP Provide a Fast-to-Market Digital Multimedia SOC Solution
- Sonics' SMART Interconnect IP Supports Greater SOC Complexity and Accelerates SOC Design Cycles
- APlabs Chooses CAST IP Cores for Next-Generation Automotive SoC
- Arteris IP FlexNoC Interconnect Again Licensed by AutoChips for Automotive SoC Product Line
- Arteris IP FlexNoC Interconnect Licensed by AutoChips for Automotive SoC Development
Breaking News
- Ubitium Debuts First Universal RISC-V Processor to Enable AI at No Additional Cost, as It Raises $3.7M
- TSMC drives A16, 3D process technology
- Frontgrade Gaisler Unveils GR716B, a New Standard in Space-Grade Microcontrollers
- Blueshift Memory launches BlueFive processor, accelerating computation by up to 50 times and saving up to 65% energy
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
Most Popular
- Cadence Unveils Arm-Based System Chiplet
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Esperanto Technologies and NEC Cooperate on Initiative to Advance Next Generation RISC-V Chips and Software Solutions for HPC
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- Arteris Selected by GigaDevice for Development in Next-Generation Automotive SoC With Enhanced FuSa Standards
|
E-mail This Article | 
|
|
Printer-Friendly Page |