USB2.0 OTG PHY supporting UTMI+ level 3 interface - 28HK/55LL
Innovative Silicon Announces Jeff Lewis Will Head Worldwide Marketing; IP Industry Innovator Rounds Out Executive Team for Z-RAM Embedded Memory Company
"ISi has a great team, strong backing, and one of the most compelling IP technologies I've seen," said Lewis. "Embedded memory is typically the largest block on a complex IC, meaning memory has a critical impact on IC cost, performance, and power consumption. Z-RAM is twice the density of embedded DRAM and five times the density of SRAM, making it -- by far -- the most cost-effective solution for the majority of embedded memory applications."
"We welcome Jeff to our organization as he is a well-known pioneer in the IP industry and brings the business and marketing expertise that will help take our business to its next stage of growth," noted Mark-Eric Jones, president and CEO of ISi. "With Jeff on board, we have assembled a truly world-class team of experienced executives and technologists."
Lewis has over 22 years of marketing, engineering, and management experience in the semiconductor IP, electronic design automation, and semiconductor industries. He was most recently president and CEO of CiraNova, Inc.
Prior to CiraNova, Lewis was Senior VP of Marketing at FormFactor, where he led the company's licensing efforts. Prior to that, he was VP of Marketing and Business Development at Artisan Components, where he ran the company's "free library" program. Currently, Lewis is also a director at IPextreme, a semiconductor IP company.
About Innovative Silicon
Incorporated in 2002, Innovative Silicon was founded to develop and commercialize Floating Body effect memory for SoC/MPU products used in diverse applications including microprocessors, handheld computers, game consoles, cellular communications devices, and cameras. The company closed its first round of VC funding in 2003, completed its first 90nm megabit Z-RAM memory designs in 2004 and its first 65nm designs in 2005. The company is incorporated in the USA with R&D in Lausanne, Switzerland. For more information, see http://www.z-ram.com.
|
Related News
- Innovative Silicon's Z-RAM Ultra Dense Memory IP Now Backed by 10th Patent; Memory Innovator Has 41 Additional Patents Pending and 5 U.S. Applications Allowed
- Innovative Silicon's Z-RAM Ultra-Dense Memory Now Backed by 21 Patents
- Innovative Silicon Inc. Ramps for Growth of Z-RAM Memory IP with New Silicon Valley Headquarters
- Innovative Silicon launches new Z-RAM technology that doubles embedded DRAM density for SoCs
- Innovative Silicon Inc. Announces Silicon Validation of Z-RAM Technology
Breaking News
- Logic Design Solutions launches Gen4 NVMe host IP
- ULYSS1, Microcontroller (MCU) for Automotive market, designed by Cortus is available
- M31 is partnering with Taiwan Cooperative Bank to launch an Employee Stock Ownership Trust to strengthen talent retention
- Sondrel announces CEO transition to lead next phase of growth
- JEDEC Publishes LPDDR5 CAMM2 Connector Performance Standard
Most Popular
- Arm's power play will backfire
- Alphawave Semi Selected for AI Innovation Research Grant from UK Government's Advanced Research + Invention Agency
- Secure-IC obtains the first worldwide CAVP Certification of Post-Quantum Cryptography algorithms, tested by SERMA Safety & Security
- Weebit Nano continuing to make progress with potential customers and qualifying its technology Moving closer to finalisation of licensing agreements Q1 FY25 Quarterly Activities Report
- PUFsecurity Collaborate with Arm on PSA Certified RoT Component Level 3 Certification for its Crypto Coprocessor to Provide Robust Security Subsystem Essential for the AIoT era
E-mail This Article | Printer-Friendly Page |