English
Innovative Silicon Announces Jeff Lewis Will Head Worldwide Marketing; IP Industry Innovator Rounds Out Executive Team for Z-RAM Embedded Memory Company
"ISi has a great team, strong backing, and one of the most compelling IP technologies I've seen," said Lewis. "Embedded memory is typically the largest block on a complex IC, meaning memory has a critical impact on IC cost, performance, and power consumption. Z-RAM is twice the density of embedded DRAM and five times the density of SRAM, making it -- by far -- the most cost-effective solution for the majority of embedded memory applications."
"We welcome Jeff to our organization as he is a well-known pioneer in the IP industry and brings the business and marketing expertise that will help take our business to its next stage of growth," noted Mark-Eric Jones, president and CEO of ISi. "With Jeff on board, we have assembled a truly world-class team of experienced executives and technologists."
Lewis has over 22 years of marketing, engineering, and management experience in the semiconductor IP, electronic design automation, and semiconductor industries. He was most recently president and CEO of CiraNova, Inc.
Prior to CiraNova, Lewis was Senior VP of Marketing at FormFactor, where he led the company's licensing efforts. Prior to that, he was VP of Marketing and Business Development at Artisan Components, where he ran the company's "free library" program. Currently, Lewis is also a director at IPextreme, a semiconductor IP company.
About Innovative Silicon
Incorporated in 2002, Innovative Silicon was founded to develop and commercialize Floating Body effect memory for SoC/MPU products used in diverse applications including microprocessors, handheld computers, game consoles, cellular communications devices, and cameras. The company closed its first round of VC funding in 2003, completed its first 90nm megabit Z-RAM memory designs in 2004 and its first 65nm designs in 2005. The company is incorporated in the USA with R&D in Lausanne, Switzerland. For more information, see http://www.z-ram.com.
|
||||||
Related News
- Innovative Silicon's Z-RAM Ultra Dense Memory IP Now Backed by 10th Patent; Memory Innovator Has 41 Additional Patents Pending and 5 U.S. Applications Allowed
- Innovative Silicon's Z-RAM Ultra-Dense Memory Now Backed by 21 Patents
- Innovative Silicon Inc. Ramps for Growth of Z-RAM Memory IP with New Silicon Valley Headquarters
- Innovative Silicon launches new Z-RAM technology that doubles embedded DRAM density for SoCs
- Innovative Silicon Inc. Announces Silicon Validation of Z-RAM Technology
Breaking News
- Ubitium Debuts First Universal RISC-V Processor to Enable AI at No Additional Cost, as It Raises $3.7M
- TSMC drives A16, 3D process technology
- Frontgrade Gaisler Unveils GR716B, a New Standard in Space-Grade Microcontrollers
- Blueshift Memory launches BlueFive processor, accelerating computation by up to 50 times and saving up to 65% energy
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
Most Popular
- Cadence Unveils Arm-Based System Chiplet
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Esperanto Technologies and NEC Cooperate on Initiative to Advance Next Generation RISC-V Chips and Software Solutions for HPC
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- Arteris Selected by GigaDevice for Development in Next-Generation Automotive SoC With Enhanced FuSa Standards
|
E-mail This Article | 
|
|
Printer-Friendly Page |