Rambus Files Patent Infringement Suit Against Micron
Delaware judge lifts stay permitting new case to move forward asserting additional patents on DDR2, GDDRx and other memory products
LOS ALTOS, California, United States - January 13, 2006 -- Rambus Inc. (Nasdaq:RMBS) today announced that it has filed a new patent infringement case against Micron Technologies (NYSE:MU) following the lifting of a stay by the Delaware court. In the case filed today, Rambus asserts infringement of its patents by DDR2, GDDR2 and GDDR3 and other memory devices that are currently shipping in the marketplace.
“These are complex cases that merit coordinated decision making,” said John Danforth, senior vice president and general counsel at Rambus. “With today’s order and our new filing, we are taking steps consistent with the nature of these cases and with our efforts over the past four years to see them resolved in California. While we prefer to resolve issues outside of the courtroom, we believe we have a strong patent position, including patents that issued in the past four years that must be defended appropriately.”
Today’s filing asserts Micron memory products infringe additional features covered by Rambus patents that are incorporated into Micron’s DDR2, GDDRx and other advanced memory products. The case filed today against Micron has been described by Rambus as a case related to currently pending cases before the Honorable Ronald Whyte: Hynix v. Rambus; Rambus v. Samsung; and Rambus v. Hynix/Samsung/Nanya.
The complaint filed today is available on Rambus’ website at http://investor.rambus.com (under Litigation Update section).
About Rambus Inc.
Rambus is one of the world’s premier technology licensing companies specializing in the invention and design of high-speed chip interfaces. Since its founding in 1990, the company's innovations, breakthrough technologies and integration expertise have helped industry-leading chip and system companies solve their most challenging and complex I/O problems and bring their products to market. Rambus’ interface solutions can be found in numerous computing, consumer, and communications products and applications. Rambus is headquartered in Los Altos, California, with regional offices in Chapel Hill, North Carolina; Bangalore, India; Taipei, Taiwan; and Tokyo, Japan. Additional information is available at www.rambus.com.
|
Related News
Breaking News
- HPC customer engages Sondrel for high end chip design
- Ubitium Debuts First Universal RISC-V Processor to Enable AI at No Additional Cost, as It Raises $3.7M
- TSMC drives A16, 3D process technology
- Frontgrade Gaisler Unveils GR716B, a New Standard in Space-Grade Microcontrollers
- Blueshift Memory launches BlueFive processor, accelerating computation by up to 50 times and saving up to 65% energy
Most Popular
- Cadence Unveils Arm-Based System Chiplet
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- TSMC drives A16, 3D process technology
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Blueshift Memory launches BlueFive processor, accelerating computation by up to 50 times and saving up to 65% energy
E-mail This Article | Printer-Friendly Page |