MIPS32 4KEc Core Powers High-Speed 802.11n WLAN Chipset from Metalink
MIPS-Based™ Design to Deliver High-Quality Multimedia Throughout the Wireless Home
"We have chosen to use the MIPS32 4KEc core in Metalink's new WLANPlus chipset due to its high performance. MIPS Technologies' 4KEc core has the capabilities necessary for our application, and provides a cost-effective solution for our needs," said Noam Benayahu, Director of VLSI with Metalink.
According to Metalink, WLANPlus is the first "real" MIMO-based (Multiple-Input Multiple-Output) wireless chipset designed to deliver data throughput of more than 240 Mbps (megabits per second) over the air with full-home coverage for video-distribution applications. It can be embedded in digital video recorders (DVRs), set-top boxes (STBs), high-definition televisions (HDTVs), media adaptors and other consumer electronics products to enable seamless multimedia connectivity throughout the home.
"High-quality wireless multimedia distribution throughout the home will give consumers tremendous convenience and flexibility, and Metalink offers a compelling solution with its new MIPS-Based WLAN chipset," said Brad Holtzinger, vice president of worldwide sales at MIPS Technologies. "By exploiting the capabilities of the 4KEc core, Metalink's design team is able to boost performance and optimize their 802.11n application in ways they couldn't do with other industry-standard cores. "
Metalink has licenses for three of MIPS Technologies' 32-bit cores, which have been used to develop a growing portfolio of cost-effective, high-performance networking solutions. The MIPS32 4Km® and MIPS32 M4K™ cores have been implemented in Metalink's DSL chips, one of which includes nine cores. The 4KEc core was used for the first time by the company in its WLANPlus chipset, which marked Metalink's entry into the WLAN market.
About the MIPS32 4KE core family
The synthesizable 4KEc core, a member of the MIPS32 4KE™ core family, gives licensees the flexibility to optimize applications for performance, size or power consumption, thereby reducing overall system costs. The 4KE core family delivers 1.53 DMIPS/MHz performance in an area as small as 1.0 mm2 in a 0.13-micron TSMC process. Licensees of the 4KEc core are broadly supported by a robust software ecosystem of operating systems, middleware, algorithms and tools for embedded applications, including wireless networking, where the MIPS® architecture has long been a leader.
About MIPS Technologies
MIPS Technologies, Inc. is a leading provider of industry-standard processor architectures and cores for digital consumer and business applications. The company drives the broadest architectural alliance that is delivering 32- and 64-bit embedded RISC solutions. The company licenses its intellectual property to semiconductor companies, ASIC developers and system OEMs. MIPS Technologies and its licensees offer the widest range of robust, scalable processors in standard, custom, semi-custom and application-specific products. The company is based in Mountain View, CA, and can be reached at +1 (650) 567-5000 or www.mips.com.
About Metalink
Metalink Broadband (NASDAQ: MTLK) is a leading provider of high performance wireless and wireline broadband communication silicon solutions. Metalink's WLAN and DSL technologies are designed to enable true broadband connectivity in every home, and its products revolutionize the broadband experience by facilitating the convergence of telecommunication, networking and entertainment.
Metalink aims to redefine the home broadband experience by introducing WLANPlus™ - a high-throughput wireless LAN technology, 5-10 times faster than currently available wireless LAN 802.11a/b/g technologies. Featuring MIMO technology adopted by the 802.11n standardization, WLANPlus enables room-to-room networking of multiple high-definition video streams.
Metalink's DSL products offer service providers a cost-effective network upgrade to support triple-play services. Using Metalink's innovative VDSL technologies operators can deliver fiber-like speeds over existing copper infrastructure. Metalink's chipsets are deployed in millions of DSL lines by leading service providers worldwide.
Metalink is a fabless semiconductor company headquartered in Yakum, Israel. The company has subsidiaries in Atlanta (US), South Korea, and Japan as well as offices in China. Further information is available at http://www.metalinkbb.com.
|
Related News
- Ralink Employs MIPS32 74K Processors in New 802.11n Dual Band WLAN AP/Router SoC
- Silvus Technologies and Ittiam Systems Announce Expanded Product Line and Commercial Availability of 802.11n IP Solution
- Redpine Signals' Lite-Fi(TM) 802.11n SoC is Among the First Devices Certified by the Wi-Fi Alliance(R) for Voice-Over-Wi-Fi(R) Applications
- Silvus Technologies and Ittiam Systems Announce Partnership to Provide 802.11n PHY/MAC IP Solution for Highest Wi-Fi Throughput and Extended Range
- Silvus Technologies Announces Commercial Availability of 802.11n PHY IP Solution
Breaking News
- Ubitium Debuts First Universal RISC-V Processor to Enable AI at No Additional Cost, as It Raises $3.7M
- TSMC drives A16, 3D process technology
- Frontgrade Gaisler Unveils GR716B, a New Standard in Space-Grade Microcontrollers
- Blueshift Memory launches BlueFive processor, accelerating computation by up to 50 times and saving up to 65% energy
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
Most Popular
- Cadence Unveils Arm-Based System Chiplet
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Esperanto Technologies and NEC Cooperate on Initiative to Advance Next Generation RISC-V Chips and Software Solutions for HPC
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- Arteris Selected by GigaDevice for Development in Next-Generation Automotive SoC With Enhanced FuSa Standards
E-mail This Article | Printer-Friendly Page |