SiRF Expands Horizons, Unveils First Multifunction Platform; SiRFLinkI(TM) Combines GPS With Bluetooth in a Single Chip
SiRFLinkI marks SiRF's first expansion into offerings that combine its flagship SiRFstarIII GPS technology with additional value added wireless connectivity functions desired by SiRF's customers. The product is targeted for a large array of platforms where both Bluetooth and GPS are becoming common functions, including devices where Bluetooth radio is used to communicate location information to other devices or applications. By integrating these functions into a seamless single-chip solution utilizing state-of-the-art silicon process and packaging technologies, SiRFLinkI provides size and power savings, as well as cost savings through a lower bill of materials.
"SiRFLinkI, our first multifunction product offering, signals an important milestone for SiRF as we continue to find innovative ways to enhance the value of solutions we provide to our customers," said Kanwar Chadha, founder and vice president of marketing for SiRF. "In a world of increasing wireless connectivity, GPS and Bluetooth are becoming common functions in most of our target markets and SiRFLinkI is optimized to address these emerging needs. We are especially proud of this achievement because we harnessed our global resources including the development capabilities of SiRF India, and the radio frequency expertise of SiRF Sweden, to produce an innovative multifunction product in such a short time."
Leveraging SiRF's Global Development Team
SiRFLinkI is the first product to take advantage of the capabilities and expertise of the newest members of the SiRF global team. Launched in 2004, SiRF India's key areas of research and development focus on newer generation chipsets and software that combine GPS with complementary technologies. This growing team played a key role in the design of the baseband circuitry of the SiRFLinkI product. Acquired in 2005, Kisel Microelectronics, AB -- now SiRF Technology AB, Sweden -- utilized its extensive expertise in complex radio frequency integrated circuit (RFIC) design to lead the multifunction radio design for the SiRFLinkI product.
Combining Architectural Innovations with Advanced Process and Packaging Technologies
SiRFLinkI utilizes a broad range of innovations and advanced technologies to provide a very compact, low power and cost-effective solution for products that need both GPS and Bluetooth functions. Based on an enhanced Bluetooth baseband core, optimized for SiRFLink architecture, from NewLogic Inc, SiRFLinkI minimizes the need for duplicate resources both on and off chip for GPS and Bluetooth functions, thus reducing system level costs.
Low power consumption, so important in consumer devices, is attained with SiRF's advanced power management technology, which automatically controls power consumption according to operating conditions as well as through utilization of advanced process technologies such as 90 nano meter CMOS for baseband functions and 0.18 nanometer SiGe technology for radio functions. Advanced packaging technology enables SiRF to pack all this functionality into a single 165-pin MCM package 6 x 8 x 1.2 mm small, thus saving precious real estate for applications, such as mobile phones, where space is a major constraint.
In addition to the small size and low power, SiRFLinkI also provides a faster time to first fix in more environments than ever before possible thanks to the power of the SiRFstarIII core combined in many cases with the SiRFLoc(TM) architecture and the new SiRFInstantFix(TM) technology, also announced today (see press release entitled, SiRFInstantFix Takes the Wait Out of GPS.) SiRFLoc, introduced in 2003, improves GPS location capability in wireless system environments by utilizing the wireless infrastructure to assist GPS, improving extremely weak signal reception, while SiRFInstantFix eliminates the initial task of obtaining GPS data from the satellites themselves, resulting in much faster time to first fixes on start-ups.
Availability
SiRFLinkI will be demonstrated to key customers at the 3GSM World Congress in Barcelona in February 2006. Production availability is expected in second half of year 2006.
About SiRF Technology Holdings, Inc.
SiRF Technology Holdings, Inc. develops and markets semiconductor and software products that are designed to enable location-awareness utilizing GPS and other location technologies, enhanced by wireless connectivity capabilities such as Bluetooth, for high-volume mobile consumer devices and commercial applications. SiRF's technology has been integrated into mobile consumer devices such as automobile navigation systems, mobile phones, PDAs, GPS-based peripherals and handheld GPS navigation devices, and into commercial applications such as location servers, asset tracking devices and fleet management systems. SiRF markets and sells its products in four target platforms: automotive, consumer electronics, mobile computing, and wireless devices. Founded in 1995, SiRF is headquartered in San Jose, Calif., and has sales offices, design centers and research facilities around the world. The company trades on the Nasdaq Stock Exchange under the symbol SIRF. Additional information about SiRF and its location technology solutions can be found at www.sirf.com.
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