MIPS, Ampro ink deal to develop embedded products
Mips, Ampro ink deal to develop embedded products
By Semiconductor Business News
September 24, 2000 (4:47 p.m. EST)
URL: http://www.eetimes.com/story/OEG20000922S0056
MOUNTAIN VIEW, Calif. -- Mips Technologies Inc. and Ampro Computers Inc. have announced an agreement that will accelerate the development of Mips processor-based systems and chips for embedded applications. Under the terms, Ampro will develop single-board system modules based on Mips' 32-bit RISC processors. Based on Ampro's EnCore platform, the modules will be designed for Internet- and other network-connected embedded systems. "This agreement will provide our licensees and their OEM customers with high-quality boards for early software development as well as wide-scale deployment, accelerating OEM product introductions," said Brian Knowles, vice president of marketing at Mips Technologies. "This agreement also gives Mips Technologies' licensees an advantage by establishing a hardware and software framework for their advanced processor implementations, not only for engineering purposes but also for use as OEM products," said Paul Rosenfe ld, vice president of marketing for Ampro, based in San Jose. "OEM customers of Mips Technologies' licensees will have the ability to significantly accelerate the development and production of embedded systems by taking advantage of industry-supported software and the variety of form-factors supported by the EnCore platform," he added. The companies did not elaborate on product shipments, but Ampro believes that its Encore platform will become a de facto standard in the industry, much like its PC/104 and EBX form-factor products.
Related News
- MIPS, Hughes ink deal to develop set-top boxes
- AIRBUS and HCL Technologies ink embedded software development deal - Project entails development of software for A340 Flight Warning System
- Toshiba, MIPS to develop fastest 64-bit embedded processor based on 'Amethyst' core
- MIPS Technologies pact with Ampro Computers to drive board standards, speed time to market for MIPS-based embedded systems
- MIPS To Showcase New Embedded and Edge AI Innovations At Computex 2024
Breaking News
- Baya Systems Raises $36M+ to Propel AI and Chiplet Innovation
- Andes Technology D45-SE Processor Achieves ISO 26262 ASIL-D Certification for Functional Safety
- VeriSilicon and Innobase collaboratively launched second-generation Yunbao series 5G RedCap/4G LTE dual-mode modem IP
- ARM boost in $100bn Stargate data centre project
- MediaTek Adopts AI-Driven Cadence Virtuoso Studio and Spectre Simulation on NVIDIA Accelerated Computing Platform for 2nm Designs
Most Popular
- Alphawave Semi to Lead Chiplet Innovation, Showcase Advanced Technologies at Chiplet Summit
- Arm Chiplet System Architecture Makes New Strides in Accelerating the Evolution of Silicon
- InPsytech Announces Finalization of UCIe IP Design, Driving Breakthroughs in High-Speed Transmission Technology
- Cadence to Acquire Secure-IC, a Leader in Embedded Security IP
- Blue Cheetah Tapes Out Its High-Performance Chiplet Interconnect IP on Samsung Foundry SF4X
E-mail This Article | Printer-Friendly Page |