NEC Electronics America to Distribute Tensilica's
Update: Cadence Completes Acquisition of Tensilica (Apr 24, 2013)
New Diamond Standard Processor Cores as Part of Its ASIC IP Offering
Santa Clara, CA – February 21, 2006 –Tensilica announced today that it has signed an expanded distribution agreement for NEC Electronics America to distribute Tensilica’s new Diamond Standard processor cores in addition to the Tensilica Xtensa configurable processor cores that NEC Electronics America has been distributing already.
“By offering Tensilica’s new Diamond Standard processor portfolio, we are expanding our ASIC IP offering for our customers,” stated Kazu Yamada, vice president and general manager, Custom SoC Solutions Strategic Business Unit, NEC Electronics America. “Tensilica’s Diamond Standard processor cores provide a variety of solutions using a common base instruction architecture, making the cores easier to integrate throughout all ASIC platforms.”
Under the agreement, Tensilica’s Diamond Standard and Xtensa processors are both directly available to NEC Electronics America’s ASIC customers under one licensing agreement. NEC Electronics America will be able to provide a complete solution for companies pursuing high-volume projects that require either standard or configurable processor cores in a feature-rich, high-density ASIC technology with world-class support.
“NEC Electronics America has a strong customer base with systems companies and fabless semiconductor suppliers, and we are excited to expand our relationship to include our new Diamond Standard processor cores,” stated Chris Rowen, Tensilica’s president and CEO.
About Tensilica
Tensilica was founded in July 1997 to address the growing need for optimized, application-specific microprocessor and DSP solutions in high-volume embedded applications. Using a patented configurable and extensible processor generation technology, Tensilica is the only company that offers a wide range of controller, CPU and specialty DSP processors in both off-the-shelf format via the Diamond Standard series cores, and with full designer-configurability with the Xtensa processor family. Every Tensilica processor core comes complete with a companion software development tool environment, portfolio of system simulation models, and hardware implementation tool support. - For more information on Tensilica's patented approach to the creation of application-specific building blocks for SOC design, visit www.tensilica.com.
|
Related News
- NEC Electronics America Announces Agreement to Distribute VaST Electronics Virtualization Solutions for Advanced NEC Electronics Automotive Microcontroller Products
- NEC Electronics America Expands ASIC IP Portfolio with Tensilica’s Xtensa Configurable Processor
- Tensilica's ConnX BBE16 DSP IP Core for Digital Baseband Signal Processing Licensed to Renesas Electronics
- LG Electronics Picks Tensilica's HiFi Audio DSP and SW Codecs for HDTV
- NEC Electronics Introduces World's First USB 3.0 Host Controller
Breaking News
- Ubitium Debuts First Universal RISC-V Processor to Enable AI at No Additional Cost, as It Raises $3.7M
- TSMC drives A16, 3D process technology
- Frontgrade Gaisler Unveils GR716B, a New Standard in Space-Grade Microcontrollers
- Blueshift Memory launches BlueFive processor, accelerating computation by up to 50 times and saving up to 65% energy
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
Most Popular
- Cadence Unveils Arm-Based System Chiplet
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Esperanto Technologies and NEC Cooperate on Initiative to Advance Next Generation RISC-V Chips and Software Solutions for HPC
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- Arteris Selected by GigaDevice for Development in Next-Generation Automotive SoC With Enhanced FuSa Standards
E-mail This Article | Printer-Friendly Page |