LSI scraps ASIC line, plans to sell DSP unit
(03/06/2006 6:08 PM EST)
SAN JOSE, Calif. — In a major restructuring effort, LSI Logic Corp. on Monday (March 6) announced that it will cease development of its RapidChip ASIC platform technology and said it would sell its digital signal processor (DSP) unit.
Consistent with its increased focus on storage, the company has also canceled its previously postponed plan for an initial public offering of its storage systems subsidiary, Engenio Information Technologies Inc.
As part of the moves, LSI Logic (Milpitas, Calif.) will cease further RapidChip ASIC development. RapidChip customer designs currently in production or under development will continue and are not affected by this action, according to the company.
The company's DSP unit, called ZSP, is expected to be sold. No timeframe for completion of this transaction is being announced at this time.
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |
|
Related News
- Cadence Extends Popular Tensilica Vision and AI DSP IP Product Line with New DSPs Targeting High-End and Always-On Applications
- OmniVision Announces World's First Dedicated Driver Monitoring System ASIC With Integrated AI Neural Processing Unit, Image Signal Processor and DDR3 Memory
- Verimatrix signs a binding agreement to sell its Silicon IP business unit to Rambus
- Verimatrix Enters into Exclusivity Agreement to Sell its Silicon IP Business Unit to Rambus
- GOWIN Semiconductor selects PLDA XpressRICH3 Controller IP as the PCIe interface block in their FPGA product line
Breaking News
- EnSilica Opens Second Brazilian Design Centre Following Multimillion Pound Design and Manufacturing Contract Win
- Alphawave Semi Reveals Suite of Optoelectronics Silicon Products addressing Hyperscaler Datacenter and AI Interconnect Market
- PolarFire® SoC FPGAs Achieve AEC-Q100 Qualification
- Strategies for Addressing More Complex Custom Chip Design
- M31 Technology - AI-Powered Automotive Dual Engines and 2nm Technology Boost Revenue to Record Highs
Most Popular
- SoftBank Group to Acquire Ampere Computing
- Strategies for Addressing More Complex Custom Chip Design
- EnSilica Agrees a Multimillion Pound Design and Manufacturing Services Contract
- M31 Technology - AI-Powered Automotive Dual Engines and 2nm Technology Boost Revenue to Record Highs
- SoCs Get a Helping Hand from AI Platform FlexGen