ARM's chairman calls for collaboration
(03/13/2006 2:42 PM EST)
SCOTTSDALE, Ariz. — The old methods for product design and development do not scale in an era when market windows are shrinking rapidly and electronics markets are being driven by fashion and style, according to Robin Saxby, chairman of ARM Holdings plc.
Delivering a keynote address at the 9th Annual Semico Summit here Monday (March 13), Saxby said solving present and future yield challenges requires collaboration between intellectual property (IP) vendors, EDA tool suppliers and chip makers.
"The only way we resolve these issues as an industry is we have to work together," Saxby said. "We need collaboration and standards. We need to share information and knowledge."
E-mail This Article | Printer-Friendly Page |
Related News
- Synopsys and Arm Extend Collaboration to Fusion Compiler to Accelerate Implementation of Arm's Next-Generation Client and Infrastructure Cores
- Synopsys and Arm Extend Collaboration to Fusion Compiler to Accelerate Implementation of Arm's Next-Generation Client and Infrastructure Cores
- Synopsys and Arm Extend Collaboration to Improve Power, Performance, and Time to Results for Arm's Latest IP and Synopsys Tools
- Linaro Announces Fujitsu's Collaboration to Accelerate High Performance Computing on ARM
- Cadence Expands Collaboration with ARM to Accelerate Custom SoC and IoT System Designs with Industry's First End-to-End Hosted Design Solution
Breaking News
- Baya Systems Raises $36M+ to Propel AI and Chiplet Innovation
- Andes Technology D45-SE Processor Achieves ISO 26262 ASIL-D Certification for Functional Safety
- VeriSilicon and Innobase collaboratively launched second-generation Yunbao series 5G RedCap/4G LTE dual-mode modem IP
- ARM boost in $100bn Stargate data centre project
- MediaTek Adopts AI-Driven Cadence Virtuoso Studio and Spectre Simulation on NVIDIA Accelerated Computing Platform for 2nm Designs
Most Popular
- Alphawave Semi to Lead Chiplet Innovation, Showcase Advanced Technologies at Chiplet Summit
- Arm Chiplet System Architecture Makes New Strides in Accelerating the Evolution of Silicon
- InPsytech Announces Finalization of UCIe IP Design, Driving Breakthroughs in High-Speed Transmission Technology
- Cadence to Acquire Secure-IC, a Leader in Embedded Security IP
- Blue Cheetah Tapes Out Its High-Performance Chiplet Interconnect IP on Samsung Foundry SF4X