CEVA to Demonstrate Industry's Lowest Cost-Per-Channel Voice over IP Platform at Spring VON 2006
Visit Booth #1638 at VON to View CEVA-VoP Demo
SAN JOSE, Calif., Spring VON 2006, March 14, 2006 - CEVA, Inc. (Nasdaq: CEVA; LSE: CVA), the leading licensor of digital signal processor (DSP) cores, multimedia, GPS and storage platforms to the semiconductor industry, today announced it will showcase the Industry's lowest cost-per-channel Voice over IP (VoIP) platform at Spring VON, San Jose, California, 14-17 March 2006, at Booth #1638.
At the show, CEVA will be demonstrating end-to-end VoIP conversation based on the latest CEVA-VoP™ development platform, which incorporates the CEVA-TeakLite-II™ high-performance DSP engine and the Xpert-TeakLite-II™ integrated subsystem, enabling voice coding, packet processing, and telephony functions.
CEVA-VoP is the latest in a line of DSP-based hardware and software application platform solutions, taking licensable Intellectual Property to new heights of system level integration. Such application platforms offer CEVA customers easy design integration together with cost, power and time-to-market benefits for developing a range of applications including mobile multimedia, digital audio and GPS. CEVA is committed to providing its customers with the industry's leading DSP technologies and ongoing support required to take CEVA-powered products from conception to delivery.
Targeting cost-sensitive applications, including dual-mode VoIP/cellular phone applications and residential gateways, CEVA-VoP is a low-power, low-cost VoIP platform containing all the necessary hardware, software and development tools that will allow product developers to easily incorporate VoIP functionality into their system-on-chips (SoCs). CEVA-VoP supports various application profiles by enabling configurability of the number and type of voice channels (1-8, utilizing G.711, G.726, G.729AB, G.723.1 and others), echo cancellation, fax relay, telephony features (tone generation/detection, caller ID, etc.) and Real Time Transport Protocol (RTP).
Complete feature details can be found at: http://www.ceva-dsp.com/vop .
About CEVA, Inc.
For more information about CEVA, Inc, visit the about section of our website.
|
Ceva, Inc. Hot IP
Related News
- CEVA and Sensory Partner to Deliver Lowest Power Voice Activation Solution Based on CEVA-TeakLite-4 DSP Platform
- Texas Instruments partners with Ittiam Systems to offer customers a highly flexible IP video phone solution based on TI's Voice over IP platform and DaVinci video technology
- Xilinx Delivers Spartan-3A Platform - World's Lowest Cost I/O-Optimized FPGAs
- CEVA Introduces Fully Integrated Ultra-Low Power Voice over IP (VoIP) Platform for Dual Mode VoIP/Cellular Phone Applications and Residential Gateways
- eInfochips Introduces Industry's Lowest Cost Development Platform for TI's DM64x based Multimedia Applications
Breaking News
- Baya Systems Raises $36M+ to Propel AI and Chiplet Innovation
- Andes Technology D45-SE Processor Achieves ISO 26262 ASIL-D Certification for Functional Safety
- VeriSilicon and Innobase collaboratively launched second-generation Yunbao series 5G RedCap/4G LTE dual-mode modem IP
- ARM boost in $100bn Stargate data centre project
- MediaTek Adopts AI-Driven Cadence Virtuoso Studio and Spectre Simulation on NVIDIA Accelerated Computing Platform for 2nm Designs
Most Popular
- Alphawave Semi to Lead Chiplet Innovation, Showcase Advanced Technologies at Chiplet Summit
- Arm Chiplet System Architecture Makes New Strides in Accelerating the Evolution of Silicon
- InPsytech Announces Finalization of UCIe IP Design, Driving Breakthroughs in High-Speed Transmission Technology
- Cadence to Acquire Secure-IC, a Leader in Embedded Security IP
- Blue Cheetah Tapes Out Its High-Performance Chiplet Interconnect IP on Samsung Foundry SF4X
E-mail This Article | Printer-Friendly Page |