TSMC Appoints Dr. Fu-Chieh Hsu as Vice President of Design and Technology Platform
“Dr. Hsu has extensive experience in the semiconductor industry. He has also cooperated with TSMC for many years,” said Dr. Tsai. “We are delighted to have Dr. Hsu join TSMC’s management team, and we believe that he will make outstanding contributions to the development of TSMC’s design services and technology platform.”
Dr. Hsu founded Monolithic System Technology Inc. (MoSys) in 1991 and served as its Chairman and Chief Executive Officer until retiring at the end of 2004. He was the Chairman and President of Myson Technology Inc. (now Myson Century Inc.) from 1990 to 1991. Prior to that, Dr. Hsu worked at Integrated Device Technology Inc. as Chief Technology Officer and Vice President as well as other senior positions. Dr. Hsu also served at Hewlett-Packard Laboratories. Dr. Hsu has published or contributed to more than 40 papers and also holds 55 U.S. patents.
Dr. Hsu received his Bachelor of Science degree in electrical engineering from National Taiwan University in 1978, and Master of Science and Ph.D. degrees in electrical engineering and computer sciences from University of California, Berkeley, in 1981 and 1983, respectively.
|
Related News
- TSMC Appoints Dr. Shang-Yi Chiang as Senior Vice President
- MoSys Co-Founder and CEO Fu-Chieh Hsu Resigns
- Flex Logix Appoints Chris Passier as Vice President, Platform Software and Vancouver, Canada Site Executive
- TSMC Senior Vice President Dr. Stephen Tso to Retire
- Kilopass Appoints Jen-Tai Hsu Vice President of Engineering
Breaking News
- Cadence to Acquire Secure-IC, a Leader in Embedded Security IP
- Blue Cheetah Tapes Out Its High-Performance Chiplet Interconnect IP on Samsung Foundry SF4X
- Alphawave Semi to Lead Chiplet Innovation, Showcase Advanced Technologies at Chiplet Summit
- YorChip announces patent-pending Universal PHY for Open Chiplets
- PQShield announces participation in NEDO program to implement post-quantum cryptography across Japan
Most Popular
- Alphawave Semi to Lead Chiplet Innovation, Showcase Advanced Technologies at Chiplet Summit
- Altera Launches New Partner Program to Accelerate FPGA Solutions Development
- Electronic System Design Industry Posts $5.1 Billion in Revenue in Q3 2024, ESD Alliance Reports
- Breaking Ground in Post-Quantum Cryptography Real World Implementation Security Research
- YorChip announces patent-pending Universal PHY for Open Chiplets
E-mail This Article | Printer-Friendly Page |