LG Electronics sues U.S. PC OEMs, alleging PCI patent infringement
![]() |
LG Electronics sues U.S. PC OEMs, alleging PCI patent infringement
By Jack Robertson, EBN
September 6, 2000 (2:13 p.m. EST)
URL: http://www.eetimes.com/story/OEG20000906S0018
LG Electronics, the South Korean electronic-products manufacturer, is demanding unspecified royalties from at least 40 PC OEMs around the world to license its patents involving the basic PCI data-transmission bus in computers. In its latest move, LGE filed suits in U.S. federal district courts against three U.S.-based PC makers and two Taiwanese computer and motherboard makers, charging violation of its patents on PCI data-transmission bus channels. An LGE spokeswoman in Seoul today confirmed that the infringement suits had been filed against DTK Computer Inc., City of Industry, Calif.; Quantex Microsystems Inc., Somerset, N.J.; and Everex Systems Inc., Fremont, Calif. In addition, LGE has filed suits against First International Computer, Tapiei, and Asustek, a Taiwanese motherboard maker. LGE said it took legal action when licensing negotiations with the five PC companies broke down. The companies sued by LGE could not be reached immediat ely for comment. Giving some credibility to its royalty campaign, LGE said last week it had signed a cross-licensing agreement with Intel Corp., Santa Clara, Calif., on a range of intellectual property including the PCI patents. LGE officials emphasized that under the agreement, Intel will make a payment of an undisclosed amount to the Korean company.
Related News
- Tela Innovations, Inc. Files Complaint at the U.S. International Trade Commission for Unfair Trade Practices Stemming from Patent Infringement
- Tri-Vision licenses U.S. V-chip to LG Electronics
- Rambus Wins Patent Infringement Trial Against Hynix; Jury awards Rambus $306.9M in damages for infringing U.S. sales
- GLOBALFOUNDRIES Files Patent Infringement Lawsuits Against TSMC In the U.S. and Germany
- ChipX signs Distribution Agreement with Nu Horizons Electronics for U.S. and Europe
Breaking News
- Siemens delivers certified and automated design flows for TSMC 3DFabric technologies
- AheadComputing Raises $21.5M Seed Round and Introduces Breakthrough Microprocessor Architecture Designed for Next Era of General-Purpose Computing
- ZeroPoint Technologies Unveils Groundbreaking Compression Solution to Increase Foundational Model Addressable Memory by 50%
- Breker RISC-V SystemVIP Deployed across 15 Commercial RISC-V Projects for Advanced Core and SoC Verification
- Veriest Solutions Strengthens North American Presence at DVCon US 2025
Most Popular
- Intel in advanced talks to sell Altera to Silverlake
- S2C Teams Up with Arm, Xylon, and ZC Technology to Drive Software-Defined Vehicle Evolution
- Siemens to accelerate customer time to market with advanced silicon IP through new Alphawave Semi partnership
- Breker RISC-V SystemVIP Deployed across 15 Commercial RISC-V Projects for Advanced Core and SoC Verification
- Arteris Revolutionizes Semiconductor Design with FlexGen - Smart Network-on-Chip IP Delivering Unprecedented Productivity Improvements and Quality of Results
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |