ANADIGICS Expands Intellectual Property Portfolio; ANADIGICS Granted Five New Patents for Innovations in RFIC Design
WARREN, N.J. -- April 5, 2006 -- ANADIGICS, Inc., a leading supplier of wireless and broadband solutions, today announced five new patents covering innovations in the design and development of radio frequency integrated circuits (RFICs). The patents strengthen the Company's impressive intellectual property portfolio and extend its technological advantages across its wireless and broadband product families.
"We continue to leverage our expertise in RFIC design to supply innovations which will power the next generation of wireless and broadband devices," said Dr. Charles Huang, Executive Vice President and Chief Technical Officer at ANADIGICS. "ANADIGICS continues to invest in extending our technology leadership and building our strong intellectual property portfolio, which is the driving force behind many of our differentiated solutions."
Patent 6,937,102 describes a new method for low bias current/temperature compensation current mirror in linear power amplifiers. The design increases the power efficiency of the overall circuit and includes a temperature compensation circuit to adjust the bias of the amplifier, to stabilize the performance in a wide temperature range.
Patent 6,970,039 was granted for efficiency enhancements for power amplifiers through the use of uniquely designed biasing circuits and combined heterojunction bipolar transistor (HBT) and field-effect transistor (FET) processes.
Patent 6,998,920 covers the monolithically fabricated HBT amplification stage with a current-limiting FET. The FET structure provides improved ruggedness by limiting the base or collector current to the HBT during severe load mismatch and/or high overdrive.
Patent 7,009,454 discloses a new method for optimizing an amplifier with an adjustable output range. This circuit provides excellent energy efficiency at many power levels by using resonant components to provide consistent operating parameters over a wide range of power levels.
Patent 7,015,519 was granted for fabricated GaAs bipolar and FET structures on the same die. This patent is being used in ANADIGICS' industry-leading InGaP-Plus(TM) technology, allowing for higher levels of integration and performance.
For additional information, contact ANADIGICS by phone (908) 668-5000 or FAX (908) 668-5132 or visit the Company's Web site at http://www.anadigics.com.
ANADIGICS, Inc. designs and manufactures radio frequency integrated circuit (RFIC) solutions for growing broadband and wireless communications markets. The Company's innovative high frequency RFICs enable manufacturers of communications equipment to enhance overall system performance, and reduce manufacturing cost and time to market. By utilizing state-of-the-art manufacturing processes for its RFICs, ANADIGICS achieves the high-volume and cost-effective products required by leading companies in its targeted high-growth communications markets. ANADIGICS was the first GaAs IC manufacturer to receive ISO 9001 certification and is certified to the ISO 9001:2000 and ISO 14001:2004 international standards.
|
Related News
- Anadigics Expands Intellectual Property Portfolio
- Nikon Purchases MMP(TM) Portfolio License; Licensing Program for Fundamental Patents Continues to Attract Support of World's Top Intellectual Property Companies
- Edgewater Wireless Expands Intellectual Property Monetization Initiatives
- Vidatronic Expands FinFET Portfolio with 7 nm to 4 nm FlexGUARD™ and Power Quencher® Intellectual Properties (IPs) Available for Licensing
- Five intellectual property trends to watch in 2013
Breaking News
- Breker RISC-V SystemVIP Deployed across 15 Commercial RISC-V Projects for Advanced Core and SoC Verification
- Veriest Solutions Strengthens North American Presence at DVCon US 2025
- Intel in advanced talks to sell Altera to Silverlake
- Logic Fruit Technologies to Showcase Innovations at Embedded World Europe 2025
- S2C Teams Up with Arm, Xylon, and ZC Technology to Drive Software-Defined Vehicle Evolution
Most Popular
- Intel in advanced talks to sell Altera to Silverlake
- Arteris Revolutionizes Semiconductor Design with FlexGen - Smart Network-on-Chip IP Delivering Unprecedented Productivity Improvements and Quality of Results
- RaiderChip NPU for LLM at the Edge supports DeepSeek-R1 reasoning models
- YorChip announces Low latency 100G ULTRA Ethernet ready MAC/PCS IP for Edge AI
- AccelerComm® announces 5G NR NTN Physical Layer Solution that delivers over 6Gbps, 128 beams and 4,096 user connections per chipset
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |