English
Chinese startup foundry licenses Toshiba technology
Mike Clendenin, EE Times
(04/21/2006 6:24 AM EDT)
TAIPEI, Taiwan — Startup IC Spectrum Co. Ltd. has inked a deal with Toshiba Corp. for the transfer of 0.35-micron manufacturing process technology, so that it can begin foundry work. The process will be used in the company’s 200-mm wafer fab currently under construction in Kunshan, northwest of Shanghai.
The fab is due to come on line early in 2007. By the end of 2008, it expects to be in volume production for 0.35-, 0.25- and 0.18-micron technologies. The company is building a monthly capacity of 35,000 wafers with its initial $450 million investment, which is roughly split between private equity and VC and government and local bank support.
(04/21/2006 6:24 AM EDT)
TAIPEI, Taiwan — Startup IC Spectrum Co. Ltd. has inked a deal with Toshiba Corp. for the transfer of 0.35-micron manufacturing process technology, so that it can begin foundry work. The process will be used in the company’s 200-mm wafer fab currently under construction in Kunshan, northwest of Shanghai.
The fab is due to come on line early in 2007. By the end of 2008, it expects to be in volume production for 0.35-, 0.25- and 0.18-micron technologies. The company is building a monthly capacity of 35,000 wafers with its initial $450 million investment, which is roughly split between private equity and VC and government and local bank support.
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