DSP Group taps Tality as SoC design center
![]() |
DSP Group taps Tality as SoC design center
By Michael Santarini, EE Times
August 29, 2000 (3:49 p.m. EST)
URL: http://www.eetimes.com/story/OEG20000829S0064
SAN JOSE, Calif. DSP Group Inc. has approved Tality Corp., the electronic design services spin-off of Cadence Design Systems Inc., as a system-on-chip (SoC) design center for its customers. Under the nonexclusive agreement, Tality will provide design-to-manufacture chips to licensees of DSP Group's SmartCores family, the companies said.. The certification will give Tality greater access to DSP Group's new technology and intellectual property (IP), which Tality will integrate into SoC designs for mutual customers. Tality will also tap DSP Group's SmartCores IP to produce hard cores that comply with the design rules of target foundries. Tality's primary SoC design center, in Livingston, Scotland, created the Aplio Trio, a single-chip processor for Internet telephony that contains two Oak DSP cores from DSP Group.
Related News
- DSP Group Unveils DBM10 Low-Power Edge AI/ML SoC with Dedicated Neural Network Inference Processor
- DSP Group Unveils New System-on-a-Chip Worldwide Solution for Residential Communication Center
- DSP GROUP INC. Unveils a new system-on-a-chip (S.O.C.) Solution for digital voice recorders and digital music players
- DSP Group, Inc. Designates Synopsys Professional Services as System-on-a-Chip Design Center for SmartCores DSP Family
- Sequence taps Qualcore for SoC center in India
Breaking News
- VeriSilicon introduces AcuityPercept: an AI-powered automatic ISP tuning system
- Avant Technology Partners with COSEDA Technologies to Enhance System-Level Software Solutions
- intoPIX Powers Ikegami's New IPX-100 with JPEG XS for Seamless & Low-Latency IP Production
- Tower Semiconductor and Alcyon Photonics Announce Collaboration to Accelerate Integrated Photonics Innovation
- Qualcomm initiates global anti-trust complaint about Arm
Most Popular
- Qualcomm initiates global anti-trust complaint about Arm
- Sarcina Technology launches AI platform to enable cost-effective customizable AI packaging solutions
- EnSilica Agrees $18m 7 Year Design and Supply ASIC Contract
- Siemens to accelerate customer time to market with advanced silicon IP through new Alphawave Semi partnership
- Tower Semiconductor and Alcyon Photonics Announce Collaboration to Accelerate Integrated Photonics Innovation
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |