TTPCom and Analog Devices, Inc. Agreement Speeds Customer Development of ADI SoftFone-based Wireless Devices
Tony Milbourn, managing director of TTP Communications plc, commented, “This agreement is the transaction that we hoped to complete in our previous financial year. It represents the next step in our relationship – it allows ADI more freedom to close and support deals directly with the end customer, and it allows TTPCom more freedom to get maximum reuse from our software.”
Christian Kermarrec, vice president, RF and wireless systems, Analog Devices, Inc. said, “This agreement enables us to provide additional service to our customers by providing a single point of contact dedicated to individual customer needs and by accelerating the availability of integrated hardware/software solutions that support new features and new generations of our SoftFone baseband chipsets.”
The value of the agreement is approximately $23 million payable in cash, of which $11 million will be paid at closing with the balance payable after the completion of certain technical milestones. Closing is expected to occur within four to six weeks.
|
Related News
- Analog Devices Collaborates With Altera To Streamline Wireless Infrastructure System Development
- EnSilica evaluation platform for EN62020 sensor interface ASIC speeds up development of wearable fitness and healthcare sensor devices
- DSP Concepts and Analog Devices Collaborate on Solution for Rapid Design of In-Vehicle Audio Entertainment Systems
- Comcores sells wireless assets to Analog Devices
- CEVA Speeds the Development of True Wireless Stereo Earbuds with its Support of Bluetooth LE Audio
Breaking News
- TSMC drives A16, 3D process technology
- Frontgrade Gaisler Unveils GR716B, a New Standard in Space-Grade Microcontrollers
- Blueshift Memory launches BlueFive processor, accelerating computation by up to 50 times and saving up to 65% energy
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
Most Popular
- Cadence Unveils Arm-Based System Chiplet
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Esperanto Technologies and NEC Cooperate on Initiative to Advance Next Generation RISC-V Chips and Software Solutions for HPC
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- Arteris Selected by GigaDevice for Development in Next-Generation Automotive SoC With Enhanced FuSa Standards
E-mail This Article | Printer-Friendly Page |