MPU startup Transmeta files IPO
MPU startup Transmeta files IPO
By Semiconductor Business News
August 17, 2000 (9:17 p.m. EST)
URL: http://www.eetimes.com/story/OEG20000817S0032
SANTA CLARA, Calif. -- Transmeta Corp. here today announced that it will file an initial public offering in an effort to generate working capital for its fledging x86-compatible microprocessor business. Serving as the underwriters for the IPO include Morgan Stanley Dean Witter, Deutsche Banc Alex. Brown, Salomon Smith Barney, Banc of America Securities LLC, and SG Cowen. Transmeta, which did not disclose details or a timetable for the IPO, hopes to use the proceeds to develop new products, expand its operations, and compete more favorably against the likes of Advanced Micro Devices Inc. and Intel Corp., analysts said. Recently, Transmeta made a big splash by rolling out its initial x86-compatible processors for notebook PCs and Internet-enabled devices. Earlier this week, the company announced a new processor for mainstream notebooks, while giving an update on its growing customer base (see Aug. 16 story).
Related News
- Mobileye files for IPO, reveals data
- OPENEDGES Files Registration Statement for the Initial Public Offering (IPO)
- GlobalFoundries Files Registration Statement for Proposed Initial Public Offering
- eASIC Files Registration Statement for Proposed Initial Public Offering
- China's VeriSilicon Files For IPO
Breaking News
- Baya Systems Raises $36M+ to Propel AI and Chiplet Innovation
- Andes Technology D45-SE Processor Achieves ISO 26262 ASIL-D Certification for Functional Safety
- VeriSilicon and Innobase collaboratively launched second-generation Yunbao series 5G RedCap/4G LTE dual-mode modem IP
- ARM boost in $100bn Stargate data centre project
- MediaTek Adopts AI-Driven Cadence Virtuoso Studio and Spectre Simulation on NVIDIA Accelerated Computing Platform for 2nm Designs
Most Popular
- Alphawave Semi to Lead Chiplet Innovation, Showcase Advanced Technologies at Chiplet Summit
- Arm Chiplet System Architecture Makes New Strides in Accelerating the Evolution of Silicon
- InPsytech Announces Finalization of UCIe IP Design, Driving Breakthroughs in High-Speed Transmission Technology
- Cadence to Acquire Secure-IC, a Leader in Embedded Security IP
- Blue Cheetah Tapes Out Its High-Performance Chiplet Interconnect IP on Samsung Foundry SF4X
E-mail This Article | Printer-Friendly Page |