Scaleo chip and Wipro-NewLogic bring together their technology to reinforce their presence in the Bluetooth applications market
Sophia Antipolis, France -- June 29, 2006 -- Scaleo chip, formerly Europe Technologies, the recognized specialist in ARM-based Systems on Chips (SoC), is reinforcing its mastery of multicore integration with the signature of a technological partnership agreement with Wipro-NewLogic, a supplier of IP blocks, in particular those operating on communication technologies such as Bluetooth and WiFi.
”The CMOS Bluetooth integrated circuits (IC’s) currently available on the market show that Bluetooth technology can now be easily integrated in an SoC. The alliance of Scaleo chip’s integration technology and Wipro-NewLogic’s Bluetooth IP will accelerate this trend by reducing integration costs and time to market” says Franz Dugand, Bluetooth technology Marketing Manager for Wipro-NewLogic.
Scaleo chip, thanks to its methodology and its integration tools, allows optimal use of Wipro-NewLogic’s Bluetooth technology, offering customers a competitive solution that integrates Bluetooth functions. The markets concerned are those of PDAs, multimedia laptops and audio applications.
“We are proud of the signature of this partnership with Wipro-NewLogic”, declared Gilles Marsigné, Scaleo chip’s VP for Sales and Marketing. “This agreement will allow Scaleo chip to lengthen its technological lead in the multimedia and communications segments, and to develop its customers portfolio. This agreement will allow users to integrate on a single SoC what is currently only available on multiple circuits. The benefit for our customers is that they can obtain a particularly competitive solution in terms of cost, power consumption and size”.
Scaleo chip hopes to meet the needs of the market for the development and series production of complex and multiprocessor custom SoC products. The originality of its offer lies in the production of the first silicon in a particularly short time frame thanks to the supply of powerful real-time evaluation tools for new architectures (FCM3), and in a hierarchical systems approach (Top-Down).
Scaleo chip’s offer also includes a library of more than 200 IPs optimised for each application, such as multimedia, automotive, and telecoms.
About Wipro-NewLogic
Wipro-NewLogic is a leading Semiconductor Design Services Provider and supplier of Intellectual Property (IP) cores for complex wireless and wireline applications; these include Wireless LAN, Bluetooth, Ultra WideBand, FireWire, Serial ATA, USB and Ethernet. The portfolio of IP cores also contains Software, silicon proven Wireless LAN multiband Radio and Mixed-Signal Blocks such as AFEs, Synthesizers, PLLs.
The services span over Digital, Analog / Mixed-Signal / RF based SoC (System-on-chip) Design, including specialized support for IP Customization, SoC and System Integration, ASIC Backend, Reference Design Development, Prototype Testing, Firmware Development, Application Development and Software Porting. We also provide post GDS2 services such as device characterization, test development and support for device production, packaging and test.
Wipro-NewLogic is the world leader in the sale of IEEE1394, WLAN and Bluetooth IPs.
For more information, visit www.wipro-newlogic.com
About Scaleo chip
Scaleo chip is based in Valbonne-Sophia Antipolis in southern France. It is a compagny specialized in the development of ARM-based SoCs and has unique expertise in the field of multicore architecture. ARM technology can be found at the heart of advanced digital products such as portable video systems, digital TV terminals, video games, imaging systems, wireless communications and telematics.
Among the firm’s customers are leading figures in the multimedia and automotive fields such as Sagem, Samsung, PSA, Daimler-Chrysler, Audi, and Mercedes Benz.
For additional information, visit www.scaleochip.com
|
Related News
- Wipro-NewLogic Reinforces Its Worldwide Leadership in Bluetooth and Wireless LAN Intellectual Property
- Wipro-NewLogic releases next generation Bluetooth IP
- Cadence Selects Wipro-Newlogic's Wireless LAN IP For Its SoC Functional Verification Kit
- Cadence Selects Wipro-NewLogic's Wireless LAN IP for its Low-Power Methodology Kit
- Wipro-NewLogic and Alereon Demonstrate Wireless USB Dual Role Device Solution
Breaking News
- TSMC drives A16, 3D process technology
- Frontgrade Gaisler Unveils GR716B, a New Standard in Space-Grade Microcontrollers
- Blueshift Memory launches BlueFive processor, accelerating computation by up to 50 times and saving up to 65% energy
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
Most Popular
- Cadence Unveils Arm-Based System Chiplet
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Esperanto Technologies and NEC Cooperate on Initiative to Advance Next Generation RISC-V Chips and Software Solutions for HPC
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- Arteris Selected by GigaDevice for Development in Next-Generation Automotive SoC With Enhanced FuSa Standards
E-mail This Article | Printer-Friendly Page |