TSMC Continues Industry Leadership with Reference Flow 7.0

Includes Statistical Timing Analysis and a New Implementation Track

SAN FRANCISCO--July 17, 2006--Taiwan Semiconductor Manufacturing Company (TSE:2330)(NYSE:TSM) today introduced Reference Flow 7.0 that features a powerful statistical static timing analyzer (SSTA), a set of new power management techniques and an array of design for manufacturing (DFM) enhancements. It also adds a Magma Design Automation design implementation track to the existing Cadence and Synopsys design tracks for easy adoption of TSMC's 65nm process technology.

"Extensive collaboration with our EDA design ecosystem partners has become the hallmark of TSMC's Reference Flows and this year is no exception," said Ed Wan, senior director of design services product marketing. "Reference Flow 7.0 continues to lower design barriers for 65nm designs and provides a proven path to success."

TSMC first opened the door for designers targeting 65nm process technology in 2005 with Reference Flow 6.0. Since then, new tools and services have been integrated into the flow and validated on TSMC's industry leading 65nm technology.

Statistical Timing Analysis

TSMC Reference Flow 7.0 is the first foundry design methodology to include a statistical timing analysis capability to optimize design margins and die yields by accurately analyzing the timing effects of manufacturing process variations. Statistical timing analysis tools are from Cadence Design Systems, Synopsys, Inc. and Magma. Capabilities include statistical SPICE models, library and IP characterization, standard cell design kits, EDA tool enhancements and corresponding design methodologies.

"Synopsys and TSMC have been collaborating to address the challenges of 65nm IC design," said Antun Domic, senior vice president and general manager of Synopsys' Implementation Group. "One of the emerging requirements is to manage the uncertainty introduced by process variation. Our statistical timing analysis and extraction solutions are a very significant extension of our widely deployed sign-off tools, helping ensure accuracy and predictable silicon performance. Together with many new technologies throughout our Galaxy(TM) Design Platform, including IC Compiler, we are delivering a comprehensive RTL-to-GDSII solution in the TSMC Reference Flow 7.0 today."

"The integration of Quartz SSTA's statistical timing analysis capabilities in TSMC's Reference Flow 7.0 Magma IC implementation track is a technological breakthrough that will enable designers to address process variations in nanometer designs," said Kam Kittrell, general manager of Magma's Design Implementation Business Unit. "We're very pleased that our software is incorporated into the TSMC Reference Flow 7.0, which reinforces our commitment to working with TSMC to speed ramp up on 65nm and lower process technology."

Power Management

Reference Flow 7.0 provides new dynamic and leakage power reduction tools, including an enhanced voltage island implementation and multi-corner timing closure. A coarse-grained power gating technique helps achieve leakage reductions of up to two orders of magnitude. New power management libraries are also included.

"To keep the design intent, it is critical to verify and validate design functionality during various power-off states to achieve low dynamic power," said Jim Miller Jr., executive vice president, Products and Technologies Organization at Cadence. "TSMC and Cadence have collaborated to meet the low-power design challenge in the new reference flow. Integrating low-power design methodology and power-management library improves designers' productivity and achieves project targets with reduced cycle time."

Design for Manufacturing (DFM)

Reference Flow 7.0 includes key DFM features that designers can exercise throughout the design cycle. For example, critical area analysis (CAA) proactively identifies potential random manufacturing defects and drives wire spreading and wire widening corrective actions. Virtual chemical mechanical polishing (VCMP) analysis identifies metal and dielectric thickness variation hot spot, and guides dummy metal insertion to improve thickness uniformity throughout the chip. In addition, selected lithography process check (LPC) post-production tools have been qualified by TSMC as DFM compliant.

New Implementation Track

Reference Flow 7.0 includes a third implementation track partner, Magma Design Automation. Similar to the implementation tracks featuring tool sets predominantly from Cadence and Synopsys, the new Magma track delineates a complete methodology using mostly Magma's tools. The flow has been validated by TSMC and is available immediately.

About TSMC

TSMC is the world's largest dedicated semiconductor foundry, providing industry's leading process technology and the foundry industry's largest portfolio of process-proven library, IP, design tools and reference flows. The company operates two advanced twelve-inch wafer fabs, five eight-inch fabs and one six-inch wafer fab. TSMC also has substantial capacity commitments at its wholly owned subsidiaries, WaferTech and TSMC (Shanghai), and its joint venture fab, SSMC. TSMC is the first foundry to provide 65nm production capabilities. Its corporate headquarters are in Hsinchu, Taiwan. For more information about TSMC please see http://www.tsmc.com.