TTPCom's software is first portable 3G protocol stack to achieve full GCF and IOT accreditation
More choice than ever before for manufacturers of 3G handsets
Cambridge, UK -- July 28, 2006 - TTPCom today announces that its 3G dual-mode protocol technology has successfully passed GCF and IOT testing and is currently undergoing final carrier acceptance trials. As such, it represents the first multiplatform 2G/3G dual mode protocol software available on the open market to achieve this high level of certification. TTPCom's dual mode protocol stack has already been integrated onto multiple silicon platforms from different vendors and is available now for license.
TTPCom has over a decade of experience in developing and licensing protocol software for 3GSM family devices. This has resulted in a cellular stack with an efficient, small memory footprint. Its single code base has evolved to encompass GSM, GPRS, EDGE, and WCDMA protocols, including HSDPA and is being extended to cover HSUPA and LTE.
"Now that our 3G technology has been independently accredited we aim to replicate the success we achieved in 2G, where our stack has powered over 100 million devices and is considered to be the defacto standard," said Gordon Aspin, head of TTPCom's Wireless Systems division.
"Our expertise in this field has delivered an efficient, flexible and robust 3G solution which will provide the industry with a credible alternative to the platforms that have dominated early 3G handsets."
H.C.Hung, VP R&D of Asustek adds: "A single software build of the TTPCom 3G protocol stack and Microsoft integration code has provided us with an excellent foundation for an entire 3G handset roadmap. It is compact and portable and offers us more flexibility than ever before in silicon platform selection, making it an efficient and cost effective option."
The TTPCom software system scales easily from low-cost, low-power single-chip 3G devices, to 3G feature phones based on TTPCom's AJAR Platform, through to high end devices such as Microsoft based smart phones or data cards with HSDPA capability.
According to Gwang Cheol Park, Vice President, R&D Division at Pantech Group: "By selecting TTPCom's protocol stack, we will be able to develop a cellular phone that will set a new standard for 3G handsets. We believe the partnership with TTPCom will bring a significant edge to our handsets."
|
Related News
- Real Time Logic Joins Andes Technology Corp.'s New Internet of Things Community Knect.me to Provide Software Stack Solutions
- 4M Wireless Completes LTE Protocol Stack Software Port For Tensilica's 3GPP LTE Reference Architecture
- Marvell Expands its 3G Portfolio; Marvell to License 3G Protocol Software Stack from Motorola
- X-Silicon Introduces the World's First Vulkan Driver Implementation for RISC-V, Enabling an entire Ecosystem of 3D Graphics, AI and Compute for Low-Power, Mobile, Edge and IOT Devices
- Ecosystem Collaborations Bring Full Stack Software Solutions to Develop Leading-edge Automotive Applications From Day One
Breaking News
- Ubitium Debuts First Universal RISC-V Processor to Enable AI at No Additional Cost, as It Raises $3.7M
- TSMC drives A16, 3D process technology
- Frontgrade Gaisler Unveils GR716B, a New Standard in Space-Grade Microcontrollers
- Blueshift Memory launches BlueFive processor, accelerating computation by up to 50 times and saving up to 65% energy
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
Most Popular
- Cadence Unveils Arm-Based System Chiplet
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Esperanto Technologies and NEC Cooperate on Initiative to Advance Next Generation RISC-V Chips and Software Solutions for HPC
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- Arteris Selected by GigaDevice for Development in Next-Generation Automotive SoC With Enhanced FuSa Standards
E-mail This Article | Printer-Friendly Page |