QUALCOMM and SMIC Form Strategic Agreement for Turnkey Semiconductor Fabrication and Test Services
Commitment to Chinese Industry Helps Shorten Time to Market With More Cost-Effective Process
SAN DIEGO -- July 27, 2006 -- QUALCOMM Incorporated (Nasdaq: QCOM - News), a leading developer and innovator of Code Division Multiple Access (CDMA) and other advanced wireless technologies, today announced a strategic agreement with Semiconductor Manufacturing International Corporation (SMIC) (NYSE: SMI - News; SEHK: 981 - News), one of the world's leading semiconductor foundries. SMIC will provide integrated circuit (IC) manufacturing services to QUALCOMM using a specialized BiCMOS process technology at its Tianjin, China facility. This agreement will combine SMIC's wafer fabrication capabilities and subcontractor infrastructure with QUALCOMM's leadership in 3G wireless technologies, with a focus on power management ICs.
"We are proud to support QUALCOMM with our proven business model and established supply chain network," said Richard Chang, president and CEO of SMIC. "This agreement demonstrates the success of SMIC's continued efforts to offer turnkey solutions to our valued customers. We look forward to a productive relationship with QUALCOMM."
"This strategic agreement with SMIC will allow QUALCOMM to leverage the foundry's operation and management expertise in mixed signal technology manufacturing and supply chain management to serve our customers in China and around the world," said Dr. Sanjay K. Jha, president of QUALCOMM CDMA Technologies. "Not only is this agreement in line with our continued commitment to China, but it also will allow us to further streamline our operations, shorten the development cycle and focus on our core technology offerings."
QUALCOMM is committed to the Chinese wireless industry, and in June 2003, the Company announced plans to invest up to US$100 million in early- to mid-stage Chinese companies engaged in the development and commercialization of CDMA-based products, applications and services. In March of this year, the Company announced the joint founding of TechFaith Software China Limited to focus on the development of application software for mobile devices.
SMIC (NYSE: SMI - News; SEHK: 981 - News) is one of the leading semiconductor foundries in the world and the largest and most advanced foundry in Mainland China, providing integrated circuit manufacturing service at 0.35um to 90nm and finer line technologies. Headquartered in Shanghai, China, SMIC operates three 8- inch fabs in Shanghai and one in Tianjin and one 12-inch fab in Beijing -- the only one of its kind in Mainland China. SMIC has customer service and marketing offices in the U.S., Italy and Japan, as well as a representative office in Hong Kong. For additional information, please visit http://www.smics.com.
QUALCOMM Incorporated (www.qualcomm.com) is a leader in developing and delivering innovative digital wireless communications products and services based on CDMA and other advanced technologies. Headquartered in San Diego, Calif., QUALCOMM is included in the S&P 500 Index and is a 2006 FORTUNE 500® company traded on The NASDAQ Stock Market® under the ticker symbol QCOM.
|
Related News
- Qualcomm and Guizhou Province Sign Strategic Cooperation Agreement and Form Joint Venture to Design and Sell World-Class Server Chipsets in China
- OKI and Wipro Form Strategic Partnership for Semiconductor Design Services
- Valens Semiconductor and Intel Foundry Services Announce Strategic Relationship for Next Generation A-PHY Product
- Intel Foundry Services and Tower Semiconductor Announce New US Foundry Agreement
- Amkor Technology and GlobalFoundries to Provide At-scale Semiconductor Test and Assembly Services in Europe
Breaking News
- Ubitium Debuts First Universal RISC-V Processor to Enable AI at No Additional Cost, as It Raises $3.7M
- TSMC drives A16, 3D process technology
- Frontgrade Gaisler Unveils GR716B, a New Standard in Space-Grade Microcontrollers
- Blueshift Memory launches BlueFive processor, accelerating computation by up to 50 times and saving up to 65% energy
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
Most Popular
- Cadence Unveils Arm-Based System Chiplet
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Esperanto Technologies and NEC Cooperate on Initiative to Advance Next Generation RISC-V Chips and Software Solutions for HPC
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- Arteris Selected by GigaDevice for Development in Next-Generation Automotive SoC With Enhanced FuSa Standards
E-mail This Article | Printer-Friendly Page |