Process Detector (For DVFS and monitoring process variation)
MoSys Launches 65nm Macro Program
Signs First 65nm Technology Licensing Agreement with Major IDM and Initiates CLASSIC Macro Designs with Pure-Play Foundries
SUNNYVALE, Calif.--Aug. 2, 2006--MoSys, Inc., the industry's leading provider of high-density System-on-Chip (SoC) embedded memory solutions announced today that it has completed the basic research and development work for porting MoSys' 1T-SRAM® embedded memory technology to the advanced 65nm semiconductor technology node and has initiated macro design work in order to move these designs into high volume consumer SoC's.
Among these initiatives, the company has signed the first 65nm technology license and royalty agreement with a major integrated device manufacturer (IDM). This agreement, which was expected to sign in the second quarter, has now been completed.
Additionally, design work has begun to create 65nm implementations of the pre-configured CLASSIC Macro product line with leading Pure-Play Foundries.
"The density and power advantages of our 1T-SRAM technology continue to improve as we scale to smaller geometries like 65nm," mentioned Chet Silvestri, Chief Executive Officer of MoSys, "and we are pleased to be working with industry-leading semiconductor manufacturers in order to make our 65nm implementations available to SoC designers."
About MoSys Inc.
Founded in 1991, MoSys, develops, licenses and markets innovative memory technologies for semiconductors. MoSys' patented 1T-SRAM technologies offer a combination of high density, low power consumption, high speed and low cost unmatched by other available memory technologies. The single transistor bit cell used in 1T-SRAM memory results in the technology achieving much higher density than traditional four or six transistor SRAMs while using the same standard logic manufacturing processes. 1T-SRAM technologies also offer the familiar, refresh-free interface and high performance for random address access cycles associated with traditional SRAMs. In addition, these technologies can reduce operating power consumption by a factor of four compared with traditional SRAM technology, contributing to making them ideal for embedding large memories in System-on-Chip (SoC) designs. MoSys' licensees have shipped more than 100 million chips incorporating 1T-SRAM embedded memory technologies, demonstrating excellent manufacturability in a wide range of silicon processes and applications. MoSys is headquartered at 755 N. Mathilda Avenue, Sunnyvale, California 94085. More information is available on MoSys' website at http://www.mosys.com.
|
Related News
- Altera Launches New Partner Program to Accelerate FPGA Solutions Development
- intoPIX Launches Access Program for Titanium Viewer and Titanium Show Apps at IBC 2024 Amsterdam
- Esperanto Technologies Launches New Cloud Access Program to Broaden Access to its Massively Parallel, Low Power RISC-V Solutions
- Imagination launches Open Access program, providing scale-ups with a low-cost path to differentiated silicon
- VESA Launches Industry's First Open Standard and Logo Program for PC Monitor and Laptop Display Variable Refresh Rate Performance for Gaming and Media Playback
Breaking News
- Breker RISC-V SystemVIP Deployed across 15 Commercial RISC-V Projects for Advanced Core and SoC Verification
- Veriest Solutions Strengthens North American Presence at DVCon US 2025
- Intel in advanced talks to sell Altera to Silverlake
- Logic Fruit Technologies to Showcase Innovations at Embedded World Europe 2025
- S2C Teams Up with Arm, Xylon, and ZC Technology to Drive Software-Defined Vehicle Evolution
Most Popular
- Intel in advanced talks to sell Altera to Silverlake
- Arteris Revolutionizes Semiconductor Design with FlexGen - Smart Network-on-Chip IP Delivering Unprecedented Productivity Improvements and Quality of Results
- RaiderChip NPU for LLM at the Edge supports DeepSeek-R1 reasoning models
- YorChip announces Low latency 100G ULTRA Ethernet ready MAC/PCS IP for Edge AI
- AccelerComm® announces 5G NR NTN Physical Layer Solution that delivers over 6Gbps, 128 beams and 4,096 user connections per chipset
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |