VeriSilicon Shipping ZSP Based ASIC for SyChip's Voice Over WLAN Module
First Pass Success ASIC Turnkey Solution with Embedded ZSP400 and VoIP Software
SANTA CLARA, Calif. -- Aug. 8, 2006 -- VeriSilicon, a leading world class ASIC design foundry and semiconductor IP provider focusing on design and manufacturing services for customers worldwide, today announced that SyChip's Voice over WLAN module for dual-mode cellular and VoWiFi phones is based on ASIC solution developed in partnership with VeriSilicon.
VeriSilicon has developed the complete ASIC from initial specification to volume delivery of finished production units, achieving first time silicon success. VeriSilicon's ZSP, a family of leading digital signal processing (DSP) cores, along with mixed-signal IPs such as audio codec makes it the leading choice for customers developing silicon for VoIP, multimedia and wireless applications. VeriSilicon's software solution, such as Z.Voice for VoIP applications, makes it the vendor of choice for voice applications.
"VeriSilicon's exceptional execution, combined with their IP has enabled SyChip to get its SyVoice(TM) solution to market in less than eight months. Their low power libraries and mixed signal IPs have allowed us to develop a very competitive product for Voice over WLAN applications in the mobile space," said George Barber, CEO of SyChip, a subsidiary of Murata. "VeriSilicon's total capability as one-stop shop including all silicon production logistics has significantly reduced our total cost of ownership."
"Achieving short time to market for differentiated products has become a key factor for success in today's highly competitive environment. VeriSilicon is helping customers to meet this challenge while lowering their cost barriers for complex SoC development and production. We are very impressed by the system knowledge of SyChip team and are delighted to meet and exceed their expectations with our turnkey ASIC services," said Dr. Wayne Dai, chairman, president, and CEO of VeriSilicon.
About VeriSilicon
VeriSilicon Holdings Co., Ltd. is a leading world class ASIC design foundry providing libraries, semiconductor IPs, design and turnkey manufacturing services with multi-fab capability and on process technologies down to 90nm. VeriSilicon has achieved first silicon success and entered volume production of many complex, multi-million gates SoCs using the leading wafer foundries in APAC and China. VeriSilicon has operations in US, China, Taiwan, Japan, France, and Korea. Over 500 customers worldwide have licensed VeriSilicon IPs and Standard Design Platforms. In 2005, VeriSilicon was ranked number three in Deloitte Technology Fast 50 China, the top 50 fastest-growing technology companies in China and number six in Deloitte Fast 500 Asia Pacific, the top 500 fastest-growing technology companies in Asia Pacific. VeriSilicon was also named one of the Red Herring 100 Private Companies of Asia, and selected as one of the EE Times 60 Emerging Startups. More information is available at www.verisilicon.com .
About ZSP®
VeriSilicon's ZSP is a family of digital signal processing (DSP) cores and solutions. With more than 50 customers worldwide, the ZSP processor architecture enables customer innovation as the DSP of choice in many key vertical markets including 3G wireless handsets, multimedia and networked voice applications. The ZSP offers a range of software compatible cores delivering performance points that meet the cost, power and efficiency constraints of today's SoC designs. A number of standard products are also available for VoIP applications. ZSP Solution Partners augment the technology with world-class software tools, EDA modeling support and a large portfolio of application software. ZSP customers include Broadcom, Marvell, IBM, Renesas, Yamaha, Huawei, Datang, Murata, AVID and many other world-class companies. More information is available at http://www.verisilicon.com/IPPortfolio_2_13_1_ZSPDSPIP.html .
About SyChip, Inc.
SyChip, a Murata Subsidiary, designs, develops and markets Radio Frequency Chip Scale Modules and Integrated Circuits for the wireless mobile market. The company focuses on developing RF modules, multifunction ASICs, software and smart utilities. SyChip's RF designs drastically reduce component count, offer very small footprints and are easy to integrate into mobile devices. SyChip has received multiple awards, including Internet Telephony's 2005 Product of the Year, Deloitte's 2005 "Fast 500", the TiEcon 2005 Emerging Star Award, MobileTrax "2005 Mobility Award", finalist for the "2005 Red Herring 100", Deloitte's 2004 "Fast 500 Rising Star Award", "Best Wireless Accessory" by Handheld Computing. For more information about SyChip, please visit http://www.sychip.com .
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