Multi-Processor SoCs: Where are the Tools?
Electronic News sat down with Simon Davidmann, president and CEO of Imperas Inc.; Chris Rowen, founder, president and CEO of Tensilica Inc.; Ian Mackintosh, president of the OCP/IP Association; Jeff Jussel, VP marketing and Americas general manager at Celoxica Ltd.; and Tom Grebinski, founder and chairman of Oasis Tooling to talk about multi-processor system-on-chips, including how good current tools are for creating them, as well as what the industry needs to move forward. What follows are excerpts of the discussion.
Related News
- Cradle Technologies, a fabless semiconductor company, Releases Multi-Processor Development Tools
- Silicon Hive announces HiveFlex VSP 2500 World's first fully-programmable multi-processor solution for Full High Definition (1080p) video codecs
- Teldix Selects Actel's ProASIC Plus FPGAs for Multi-Processor Boards Used in the Eurofighter Project
- Accelerated Technology Announces Nucleus IPC for Rapid Development of Multi-Processor Applications
- Lauterbach Debugger Delivers Multi-Processor Support for Altera's Nios II Embedded Processor
Breaking News
- JEDEC® and Industry Leaders Collaborate to Release JESD270-4 HBM4 Standard: Advancing Bandwidth, Efficiency, and Capacity for AI and HPC
- BrainChip Gives the Edge to Search and Rescue Operations
- ASML targeted in latest round of US tariffs
- Andes Technology Celebrates 20 Years with New Logo and Headquarters Expansion
- Creonic Unveils Bold Rebrand to Drive Innovation in Communication Technologies
Most Popular
- Cadence to Acquire Arm Artisan Foundation IP Business
- AMD Achieves First TSMC N2 Product Silicon Milestone
- Why Do Hyperscalers Design Their Own CPUs?
- Siemens to accelerate customer time to market with advanced silicon IP through new Alphawave Semi partnership
- New TSN-MACsec IP core for secure data transmission in 5G/6G communication networks
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |