Winbond Electronics Corporation and Qimonda AG Announce New Agreement for Technology Transfer
The 80nm process technology transfer agreement signed between Winbond and Qimonda is mainly for the needs of advanced technology of Memory Products, and this technology will play a crucial role for Winbond 12-inch fab. Winbond currently provides part of the production capacity for Qimonda, and the two companies share the profits as well. The mutually beneficial relationships of technology and production capacity cooperation agreement are a win-win situation for both sides.
By signing this agreement to transfer the 80nm process technology with Qimonda, Winbond expects to enter the volume production stage in the second quarter of 2007. For Winbond¥Œs Memory Business Group, this agreement does not only declare the deployment and ambition of its constant improvement for process technology, but also emphasize that the strategy guidelines of focusing on mobile Memory Product solutions have never been changed. Winbond will continuously use the current DRAM process technology as its core to develop Low Power DRAM, Pseudo SRAM, Flash, and other niche products to expand the Memory market share of mobile phone appliances field and other mobile memory electronic products.
The current production yield of Winbond¥Œs 12-inch fab is better than expectation, and the capacity is expected to reach 24,000 wafers per month by the end of this year. In addition, 90nm process technology is also used to produce products as originally planned.
Winbond collaboration with Qimonda for the 110nm and 90nm process technology transfer has reached a big success. After the recent 80nm process technology transfer, it is expected to consolidate the foundation for future high-level technology transfer cooperation between the two companies.
|
Related News
- Winbond Electronics Corporation and Qimonda AG Announce New Agreement for 65 nanometer Buried Wordline Technology Transfer
- Winbond Plans to Enter Product Transfer and Technology Licensing Agreement with Qimonda AG for Graphic DRAM
- Qimonda Further Extends Foundry Agreement with Winbond
- Winbond Electronics Corporation Signed a NT$ 15 Billion Syndicated Loan Agreement with Bank of Taiwan and Other 21 Financial Institutions
- Samsung Electronics and AMD Extend Strategic IP Licensing Agreement To Bring AMD Radeon™ Graphics to Future Mobile Platforms
Breaking News
- Frontgrade Gaisler Unveils GR716B, a New Standard in Space-Grade Microcontrollers
- Blueshift Memory launches BlueFive processor, accelerating computation by up to 50 times and saving up to 65% energy
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Cadence Unveils Arm-Based System Chiplet
Most Popular
- Cadence Unveils Arm-Based System Chiplet
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Esperanto Technologies and NEC Cooperate on Initiative to Advance Next Generation RISC-V Chips and Software Solutions for HPC
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- Arteris Selected by GigaDevice for Development in Next-Generation Automotive SoC With Enhanced FuSa Standards
E-mail This Article | Printer-Friendly Page |