Siano Enables TV Everywhere With Launch of New Multi-standard, Multi-band Single-chip Receiver for Mobile TV
NETANYA, Israel -- August 29, 2006 -- Siano Mobile Silicon, a fabless semiconductor maker of solutions for Mobile Digital TV (MDTV), announced today the launch of its new product, the SMS1010 single-chip receiver for mobile digital TV (MDTV).
In addition, the company announced integrated single chip solutions available from its partners Alps Electric and Samsung Electro-Mechanics, using Siano's SMS1000 CMOS silicon.
Siano's newly sampled SMS1010, as well as Alps' TDPE1 and Samsung Electro-Mechanics' MCS01M, will be demonstrated in Siano's booth (Mobile Zone Area, Stand 255) in the up-coming IBC trade show, September 8-12 in Amsterdam.
Siano's SMS1010 multi-band, multi-standard low power and small size solution enables TV reception everywhere on a variety of handheld devices, such as mobile phones, PDAs, portable video and media players, notebooks, and more. The SMS1010's integrative and system oriented design approach enables the integration of MDTV functionality to mobile and handheld systems at a reduced system cost, minimum physical space, and fast time to market.
Siano's SMS1010 supports several MDTV standards utilized in the different geographies in the world, including DVB-T, DVB-H, T-DMB, DAB and DAB-IP, as well as four different spectrum bands. Packaged in a thin LGA package, the all-CMOS SMS1010 measures 7.9mm x 6.2mm x 1mm, and integrates an RF tuner and demodulator. The SMS1010's average power consumption in DVB-H mode is less than 22mW. Additionally, unlike some of its competing solutions, the SMS1010 does not need any external memory, nor a VCO.
"As the mobile DTV market starts ramping up, and especially in 2007, customers need a single chip solution at prices below $10," said Alon Ironi, CEO, Siano. "The SMS1010 exactly targets this need."
Through its partners Alps Electric and Samsung Electro-Mechanics, Siano now also offers highly integrated single-chip solutions that include all passive components, making miniature chip-like modules for MDTV:
- Alps Electric, the leading Japanese supplier of broadcasting tuners and modules for wireless applications such as WLAN (WiFi) and Bluetooth, offers the TDPE1 Type module for MDTV.
- Samsung Electro-Mechanics, Korea's leading maker of electronic parts and components, offers the MCS01M, a 9 x 11x 1.4 mm module for MDTV. The MCS01M comes in a BGA-48 pin package. In addition, Samsung Electro-Mechanics offers a miniature MDTV USB card, which seamlessly turns every notebook computer into a mobile
TV set.
About Siano Mobile Silicon
Siano Mobile Silicon provides integrated silicon receivers for the mobile digital TV (MDTV) market. Tailored specifically for handheld and mobile devices, the company's all-CMOS multi-standard solution overcomes formidable engineering challenges such as mobility reception, hand-offs, power consumption, form factor and small antenna. Since its establishment in June 2004, Siano raised $34.5M from JVP, Walden Israel, Star Ventures, and Bessemer Venture Partners. The company has more than 50 employees. It is based in Israel, with business development offices in Beijing, Taipei, and Seoul. In May 2005 Siano was selected to the prestigious Red Herring 100 Europe, a list of the most promising start-ups in the EMEA area.
For additional information on Siano Mobile Silicon's solutions, please visit www.siano-ms.com.
About Alps Electric
Since its establishment in 1948, Alps has been perfecting the art of electronics as a comprehensive manufacturer of electronic components. Alps creates innovative high-value-added products in its main business segments - Components, Automotive Electronics, Communications, Peripheral Products, and Magnetic Devices, which contribute to the advance of a digital society. Alps is a global company that carries out its operations with 23 production bases in 9 countries as well as 57 sales bases in 14 countries. Consolidated net sales in the year ended March 31, 2006 amounted to ¥709,613 million.
For additional information on Alps Electric, please visit www.alps.com.
About Samsung Electro-mechanics
Samsung Electro-Mechanics (SEM) was established in 1973 as a manufacturer of key electronic components, and the company has grown into one of the industry leaders, thanks to cutting-edge technology and top product quality.
SEM pioneered the technological framework for Korean production of A/V components in the 1970s, and in the 1980s the company diversified into materials and computer parts In the early 1990s, the focus was on manufacturing chip components, multi-layer circuit boards ,and mobile communication components. In the late 1990s, operations expanded into the production of digital products with applied high-frequency, software, engineering and design technologies.
These changes, combined with uncompromising quality, helped Samsung Electro-Mechanics to become the leading electronic parts maker in a major world player.
Sales for FY 2005 reached approximately US $2.5 billion
Samsung Electro-Mechanics, which directly sells over 80 percent of its own products, operates manufacturing facilities, R&D distribution and sales centers, and offices in the U.S., Europe, Japan, China and Southeast Asia.
As a Global Supplier, we guarantee distribution of our high quality products in any corner of the world.
|
Related News
- MediaPhy Launches Multi-Standard Single-Chip for Global Mobile TV Applications
- NemeriX Awarded Patent For Single-Chip Multi-Band GNSS RF Receiver Technology
- Imagination Technologies Launches Multi-Standard Mobile TV Receiver Core with 1seg ISDB-T Support
- Thin Multimedia to Develop a Multi-Standard Mobile TV Solution With Siano
- Imagination Technologies and Sharp Demonstrate the World's Most Advanced Multi-Standard Mobile TV Module at MWC 2008
Breaking News
- Intel CEO's Departure Leaves Top U.S. Chipmaker Adrift
- Post-Quantum Cryptography: Moving Forward
- Arteris Deployed by Menta for Edge AI Chiplet Platform
- Allegro DVT Launches TV 3.0 Test Suite for Brazil's Next Generation Digital Terrestrial Television System
- Marvell Unveils Industry's First 3nm 1.6 Tbps PAM4 Interconnect Platform to Scale Accelerated Infrastructure
Most Popular
- Intel Announces Retirement of CEO Pat Gelsinger
- Tenstorrent closes $693M+ of Series D funding led by Samsung Securities and AFW Partners
- HighTec C/C++ Compiler Suite Supports Andes' ISO 26262 Certified RISC-V IP for Automotive Safety and Security Applications
- VeriSilicon partners with LVGL to enable advanced GPU acceleration for wearable devices and beyond
- Alphawave Semi Drives Innovation in Hyperscale AI Accelerators with Advanced I/O Chiplet for Rebellions Inc
E-mail This Article | Printer-Friendly Page |