Ground shifting in multicore interconnect battleground
Oct 2 2006 (9:00 AM)
A battle royal is shaping up behind the scenes as Advanced Micro Devices Inc. and Intel Corp. race to define interconnects for their next-generation multicore processors. The archrivals hope to use those links to weave separate webs of partnerships that will be keys to success in tomorrow's computer industry.
Last week, a broad group of chip and systems makers led by Intel and IBM Corp. launched Geneseo, code name for a set of extensions to PCI Express that aim to help graphics chips and other accelerators plug directly into a coherent processor. The news, delivered at last week's Intel Developer Forum in San Francisco, came in the wake of AMD's June announcement that it would invite the industry to plug into its proprietary HyperTransport CPU bus as part of a new program dubbed Torrenza.
The interconnects are likely to become part of the secret sauce for both companies' future multicore architectures. The extent to which the two are able to court the industry to provide blocks that may plug into 16 (or more) core CPUs could be a make-or-break factor in the two companies' turf wars in 2010 and beyond.
The Geneseo proposals aim to extend Express in four broad areas, providing fine-grained power management, a locking mechanism for shared memory, hints to help a coherent processor handle I/O more effectively, and memory and protocol efficiencies for mapping virtual to physical memory. The group may develop additional proposals in the future.
The resulting improvements fall short of creating a cache-coherent version of Express; as such, they do not provide all the underpinnings offered by the coherent HyperTransport (cHT) technology at the heart of AMD's Torrenza program. Nevertheless, functionally the Express extensions aim to address many of the same core uses as Torrenza, including providing a standard connection between a pro- cessor and accelerators for functions that could include networking and XML processing.
E-mail This Article | Printer-Friendly Page |
Related News
- Semidynamics and SignatureIP create a fully tested RISC-V multi-core environment and CHI interconnect
- Synopsys Extends Performance Exploration Solution for ARM AMBA 4 Interconnect-based Multicore SoCs
- CEVA and Arteris Partner on Multi-Core Interconnect for Next Generation SoC Designs
- Marvell Unveils Industry's First 3nm 1.6 Tbps PAM4 Interconnect Platform to Scale Accelerated Infrastructure
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
Breaking News
- Baya Systems Raises $36M+ to Propel AI and Chiplet Innovation
- Andes Technology D45-SE Processor Achieves ISO 26262 ASIL-D Certification for Functional Safety
- VeriSilicon and Innobase collaboratively launched second-generation Yunbao series 5G RedCap/4G LTE dual-mode modem IP
- ARM boost in $100bn Stargate data centre project
- MediaTek Adopts AI-Driven Cadence Virtuoso Studio and Spectre Simulation on NVIDIA Accelerated Computing Platform for 2nm Designs
Most Popular
- Alphawave Semi to Lead Chiplet Innovation, Showcase Advanced Technologies at Chiplet Summit
- Arm Chiplet System Architecture Makes New Strides in Accelerating the Evolution of Silicon
- InPsytech Announces Finalization of UCIe IP Design, Driving Breakthroughs in High-Speed Transmission Technology
- Cadence to Acquire Secure-IC, a Leader in Embedded Security IP
- Blue Cheetah Tapes Out Its High-Performance Chiplet Interconnect IP on Samsung Foundry SF4X