7 µW always on Audio feature extraction with filter banks on TSMC 22nm uLL
Conexant expands its foundry deal with UMC
![]() |
Conexant expands its foundry deal with UMC
By Semiconductor Business News
July 12, 2000 (10:22 a.m. EST)
URL: http://www.eetimes.com/story/OEG20000712S0008
NEWPORT BEACH, Calif. -- Conexant Systems Inc., a leading integrated devices manufacturer (IDM), is moving a larger share of its production to an outside supplier. The big supplier of communications chips, which now claims a run rate of $2 billion annually, today announced it has signed a long-term strategic agreement with United Microelectronics Corp. (UMC), the giant Taiwanese silicon foundry. The deal gives Conexant a guaranteed foundry capacity. Conexant said it will receive "significant" foundry capacity and access to UMC's advanced process technology to support future growth. The two companies, which have been working together for five years, wouldn't give any details of their new agreement. "Strong foundry relationships are a core component of Conexant's manufacturing strategy for meeting customer volume commitments," commented Terry Ellis, senior vice president at the Newport Beach company. "Given the explosive demand in [our] marke ts, we must augment our internal manufacturing with guaranteed, world-class foundry capacity that features leading-edge processes."
Related News
- India's Wipro expands IC-design services by striking foundry deal with UMC
- UMC Expands X Architecture Support -- First Pure-Play Foundry to Provide Qualified 90-nm Design Rules
- ARM widens access to processor core with UMC foundry deal
- Alphawave Semi Expands Partnership with Samsung Foundry to Further Drive Innovation at Advanced Semiconductor Nodes
- Intel and UMC Announce New Foundry Collaboration
Breaking News
- Breker RISC-V SystemVIP Deployed across 15 Commercial RISC-V Projects for Advanced Core and SoC Verification
- Veriest Solutions Strengthens North American Presence at DVCon US 2025
- Intel in advanced talks to sell Altera to Silverlake
- Logic Fruit Technologies to Showcase Innovations at Embedded World Europe 2025
- S2C Teams Up with Arm, Xylon, and ZC Technology to Drive Software-Defined Vehicle Evolution
Most Popular
- Intel in advanced talks to sell Altera to Silverlake
- Arteris Revolutionizes Semiconductor Design with FlexGen - Smart Network-on-Chip IP Delivering Unprecedented Productivity Improvements and Quality of Results
- RaiderChip NPU for LLM at the Edge supports DeepSeek-R1 reasoning models
- YorChip announces Low latency 100G ULTRA Ethernet ready MAC/PCS IP for Edge AI
- AccelerComm® announces 5G NR NTN Physical Layer Solution that delivers over 6Gbps, 128 beams and 4,096 user connections per chipset
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |