Experts: design offshoring yielding mixed results
(11/03/2006 1:21 PM EST)
WASHINGTON — The globalization of semiconductor design is providing some competitive benefits for U.S. chip makers but is roiling the U.S. job market for engineers, a university study concludes.
A survey conducted by Clair Brown and Greg Linden of the University of California at Berkeley and presented at a National Academy of Engineering workshop on engineering offshoring found that the U.S. remains the leader in advanced chip design. But growing costs, competitive pressures and globalization are reshaping the industry in ways that are just now being understood.
"So far, offshore activities appear to complement design activities with expansion" in the U.S., the authors found. But the "long-run impact on U.S. leadership and jobs [remains] unclear."
In the meantime, China and India will grow in importance as markets and suppliers of engineers and design skills, they added.
E-mail This Article | Printer-Friendly Page |
Related News
- Analog Bits Showcases Silicon of Analog and Mixed Signal IP Products on TSMC N7 Process Targeting Automotive Grade with Split Corner Lots and PVT Characterization Results Available
- TSMC mixed results mirror uncertain outlook
- Ceva, Inc. Announces Third Quarter 2024 Financial Results
- Arteris Announces Financial Results for the Third Quarter 2024 and Fourth Quarter and Full Year 2024 Guidance
- EnSilica plc - Audited Full Year Results for the Year Ended 31 May 2024
Breaking News
- Ubitium Debuts First Universal RISC-V Processor to Enable AI at No Additional Cost, as It Raises $3.7M
- TSMC drives A16, 3D process technology
- Frontgrade Gaisler Unveils GR716B, a New Standard in Space-Grade Microcontrollers
- Blueshift Memory launches BlueFive processor, accelerating computation by up to 50 times and saving up to 65% energy
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
Most Popular
- Cadence Unveils Arm-Based System Chiplet
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Esperanto Technologies and NEC Cooperate on Initiative to Advance Next Generation RISC-V Chips and Software Solutions for HPC
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- Arteris Selected by GigaDevice for Development in Next-Generation Automotive SoC With Enhanced FuSa Standards