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TSMC Board Approves Capital Appropriation for 65nm and 90nm Capacity
Hsinchu, Taiwan, November 7, 2006 - TSMC (TAIEX: 2330, NYSE: TSM) today held a meeting of the Board of Directors, which approved capital appropriation of US$1,133.4 million to expand 65 and 90 nanometer process capacity in 300mm wafer fabs.
TSMC Spokesperson and Vice President Ms. Lora Ho said other major conclusions of the Board meeting were as follows:
1. Approved capital appropriation of US$9.2 million to expand 1.0 micron high voltage process capacity in Fab 2.
2. Approved the purchase of an additional 6.8% of shares in Systems on Silicon Manufacturing Company Pte. Ltd. (SSMC) at a price of approximately US$73 million. TSMC will own 38.8% of SSMC after the purchase.
3. Approved capital increase of NT$24,828,340 to reflect the issuance of 2,482,834 new TSMC common shares as a result of employees exercising their stock options between July 1 and September 30, 2006. Subsequent to such capital increase, the registered paid-in capital of TSMC will be NT$258,258.4 million.
TSMC Spokesperson and Vice President Ms. Lora Ho said other major conclusions of the Board meeting were as follows:
1. Approved capital appropriation of US$9.2 million to expand 1.0 micron high voltage process capacity in Fab 2.
2. Approved the purchase of an additional 6.8% of shares in Systems on Silicon Manufacturing Company Pte. Ltd. (SSMC) at a price of approximately US$73 million. TSMC will own 38.8% of SSMC after the purchase.
3. Approved capital increase of NT$24,828,340 to reflect the issuance of 2,482,834 new TSMC common shares as a result of employees exercising their stock options between July 1 and September 30, 2006. Subsequent to such capital increase, the registered paid-in capital of TSMC will be NT$258,258.4 million.
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