USB2.0 OTG PHY supporting UTMI+ level 3 interface - 28HK/55LL
IDT And Texas Instruments Development Platform Enables Higher Performance and Faster Time to Market for 3G Wireless Base Station Designs
SAN JOSE, Calif.-- November 13, 2006 --IDT™ (Integrated Device Technology, Inc.; NASDAQ:IDTI), a leading provider of vital semiconductor solutions, today announced achievement of full interoperability between the IDT pre-processing switch (PPS) and the highest performance digital signal processors (DSP) from Texas Instruments (TI). Through this strong collaboration, both IDT and TI developed a robust 3G base station development platform that speeds customer time to market by jumpstarting mission critical software programming and enabling rapid, early prototyping. These efforts enable IDT and TI to build-out the Serial RapidIO® ecosystem through the development of an interoperable baseband processing solution, providing wireless base station designers an excellent means to achieve higher-performance digital signal processing. The development platform integrates the IDT PPS with four TI DSPs on an advanced mezzanine card (AMC), which simply plugs into a PC.
“As our customers embark upon the next generation of challenging base station designs, known to take up to two years to develop, they’ve encouraged wireless base station vendors to ensure availability of a robust inventory of devices that are interoperable,” stated Bill Beane, senior product manager for the IDT Flow-control Management Division. “Our collaboration with TI addresses these issues, and the resulting development platform conclusively demonstrates that the IDT PPS and the TI DSPs interoperate as required in a real system, while its software tools allow our customers to reduce their design development times.”
“Next generation cellular standards demand DSP-intensive base stations capable of delivering the high bandwidth required for advanced wireless services, such as mobile video, at a competitive price,” said John Smrstik, marketing manager for the Texas Instruments Communications Infrastructure and Voice Group. “IDT’s pre-processing switch enables OEMs to gain the most efficient use of our DSPs’ processing power.”
The Development Platform
The AMC70K2000 development platform -- jointly created by IDT and TI -- offers a diverse mix of hardware options and software tailored for baseband processing demonstrations and development. The offering includes an AMC and all of the software necessary for rapid setup, initialization, and on-site evaluation of the PPS capabilities. The platform enables realistic case studies for moving tasks and operations from the DSPs to the PPS and observing the system responses. The AMC deploys four fabric-connected TI DSPs (TMS320C6455/6482) and the IDT PPS (70K2000) offering a RapidIO interface of 40 lanes and 22 ports; accelerating each DSP in a cluster by up to 20 percent. It has a three Gigabit Ethernet backplane, one line I/O; DRAM DDR2 up to 128 Mbytes per DSP; flash storage (serial high speed) and I2C; JTAG for system boot master, MMC; MMC control for IPMI with additional applications; and a local-power option for stand-alone operation. A built-in expansion port offers the ready addition of a daughter card supporting other Serial RapidIO endpoints, including the new IDT 10G serial buffer (see today’s related announcement: “IDT Unveils 10G Serial Buffer to Enable Advanced DSP-Intensive Wireless Services for 3G and Beyond”).
Pricing and Availability
The development platform is currently shipping, and is priced at $5,995. For additional product information on the development platform, visit www.IDT.com.
About IDT
IDT is a world leader in developing and delivering vital semiconductor solutions that enable customers to accelerate innovation. IDT solutions help customers solve complex system design challenges associated with the evolving requirements of communications, computing and consumer applications. By leveraging its system knowledge and extensive blend of technologies, IDT is able to deliver essential solutions, including timing products, network search engines, flow-control management ICs and products for standards-based serial switching. Headquartered in San Jose, Calif., IDT has design, manufacturing and sales facilities throughout the world. IDT stock is traded on the NASDAQ Global Select Market® under the symbol “IDTI.” Additional information about IDT is accessible at www.IDT.com.
|
Related News
- MoSys, Radiocomp and GDA Technologies Partner to Deliver CPRI and OBSAI Compliant Wireless SerDes IP Solution for 3G and LTE Base Station Market
- Mentor Graphics Collaboration with National Instruments Speeds Time to Market with Faster Test Bench Development
- S3 Group and Texas Instruments Deliver First Continua Certified Platform for Faster Development of Telehealth Devices
- Altera and Elektrobit Offer First OBSAI RP3-01 Development Kits for Wireless Base Station Designs
- Virtio Virtual Platforms Enable Texas Instruments to Accelerate Software Development and Customer Time-to-Market
Breaking News
- Logic Design Solutions launches Gen4 NVMe host IP
- ULYSS1, Microcontroller (MCU) for Automotive market, designed by Cortus is available
- M31 is partnering with Taiwan Cooperative Bank to launch an Employee Stock Ownership Trust to strengthen talent retention
- Sondrel announces CEO transition to lead next phase of growth
- JEDEC Publishes LPDDR5 CAMM2 Connector Performance Standard
Most Popular
- Arm's power play will backfire
- Alphawave Semi Selected for AI Innovation Research Grant from UK Government's Advanced Research + Invention Agency
- Secure-IC obtains the first worldwide CAVP Certification of Post-Quantum Cryptography algorithms, tested by SERMA Safety & Security
- Weebit Nano continuing to make progress with potential customers and qualifying its technology Moving closer to finalisation of licensing agreements Q1 FY25 Quarterly Activities Report
- PUFsecurity Collaborate with Arm on PSA Certified RoT Component Level 3 Certification for its Crypto Coprocessor to Provide Robust Security Subsystem Essential for the AIoT era
E-mail This Article | Printer-Friendly Page |