TES and Wisair Collaborate to Deliver Ultra Wideband Solutions
TES provides an extensive range of IP, design and manufacturing services and has market-leading expertise in implementing wireless technologies such as DECT, Bluetooth, Emergency Beacons and ZigBee.
"We are pleased to collaborate with a leading design house such as TES," said David Yaish, Wisair CEO. "TES is uniquely positioned to provide UWB IP, development tools and design services that complement our chipset offerings. Through this collaboration, both companies will be able to expand into new UWB markets."
Combining in-depth knowledge of high and low data rate UWB technologies in partnership with a leading chip provider, TES offers a clear advantage to customers requiring customization of a wide range of UWB applications in B2B communications.
By investing in cutting-edge wireless technology such as UWB, TES offers customers a fast time to market and efficient use of global resources via its unique Custom Design & Manufacture "CDM" program.
"The combination of TES and Wisair's product and development knowledge brings even greater added value to the UWB solutions that TES is able to offer," said Nick Walker, senior VP sales and marketing at TES. "Wisair's UWB chipset has really increased the advantage we are able to provide to the B2B communications market and the agreement is a win-win-win for TES, Wisair and its customers."
TES will be providing a UWB demo at the Electronica Embedded Conference, which is taking place in Munich, November 14-19
About TES - www.tesbv.com
TES Electronic Solutions is a global electronics services company with a focus on innovative custom solutions for a wide variety of technology and services industries.
TES solutions include integrated circuits, software, hardware and systems. The company has delivered solutions to blue-chip companies worldwide from its 17 design and manufacturing locations.
TES's services cover all phases of the product life-cycle including new product introduction. The company has the know-how and resources to offer consulting and IP licensing, as well as to design and manufacture on a turnkey or other basis. Its customers also benefit from a truly global operation where the relationship is managed locally while design and manufacturing work is carried out in the most appropriate TES location worldwide.
TES's Custom Design and Manufacturing (CDM) solutions provide customers with systems or sub-systems that improve their existing operations or enable them to exploit a market opportunity in the fastest possible time.
Headquartered in Langon-sur-Vilaine in north western France, the company employs 900, of whom 500 are design engineers. It has 15 design centers and project offices located in Silicon Valley (US), Edinburgh (UK), Paris, Rennes, Grenoble, Nice (France), Stuttgart, Dusseldorf, Hamburg, Berlin, Nuremburg, Munich (Germany), Bangalore (India) and Tokyo (Japan). Its two factories are in Rennes (France) and Penang (Malaysia).
About Wisair
Wisair is a leading provider of WiMedia Ultra Wideband (UWB) chipset solutions based on Certified Wireless USB for consumer electronics, PC peripherals, and mobile devices. Leveraging the management teams' decades of wireless communications product development expertise, Wisair is the first company to deliver fully-functional WiMedia-based UWB chipsets and small form-factor reference designs. Today, the fabless semiconductor company continues to focus on delivering low-cost, low-power, and high bit-rate wireless connectivity solutions. For more information, visit the company's web site at www.wisair.com.
|
TES Electronic Solutions SA Hot IP
Related News
- Wisair Secures $24 Million in Funding
- Achronix and BigCat Wireless Collaborate to Deliver Unprecedented Power Efficiency and Performance for 5G/6G Wireless Applications
- TSMC and Cadence Collaborate to Deliver AI-Driven Advanced-Node Design Flows, Silicon-Proven IP and 3D-IC Solutions
- Chevin Technology, Alpha-Data & Correct Designs collaborate to deliver fast and secure data offload for NASA-JPL's Airborne Visible/Infrared Imaging Spectrometer-3 (AVIRIS-3)
- Siemens and Intel Foundry collaborate to deliver new tools certifications and EMIB/3D-IC innovation
Breaking News
- Frontgrade Gaisler Unveils GR716B, a New Standard in Space-Grade Microcontrollers
- Blueshift Memory launches BlueFive processor, accelerating computation by up to 50 times and saving up to 65% energy
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Cadence Unveils Arm-Based System Chiplet
Most Popular
- Cadence Unveils Arm-Based System Chiplet
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Esperanto Technologies and NEC Cooperate on Initiative to Advance Next Generation RISC-V Chips and Software Solutions for HPC
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- Arteris Selected by GigaDevice for Development in Next-Generation Automotive SoC With Enhanced FuSa Standards
E-mail This Article | Printer-Friendly Page |