CoWare Integrates Microsoft Windows Embedded CE on Virtual Platforms for Software Development
CoWare Joins Microsoft Embedded Partner Program to Give Windows Embedded CE Developers the Ability to Build, Integrate, and Test Software Before Silicon is Available
SAN JOSE, Calif. – December 11, 2006 – CoWare, Inc., the leading supplier of electronic system-level (ESL) design software and services, announced the CoWare Virtual Platform product family is now interoperable with the Windows Embedded CE operating system. As a result, companies developing Windows Embedded CE-based electronics devices can start their software development before physical hardware is available, which results in lower cost product development and faster time-to-market.
“Virtual Platforms are transforming the way companies approach software development,” said Marc Serughetti, director of marketing at CoWare. “Integrating CoWare Virtual Platforms with leading run-time technologies for embedded devices such as Microsoft Windows Embedded CE, will help our customers realize the benefits of this new software development paradigm.”
About CoWare Virtual Platforms for Software Development
Virtual platforms for software development are fast and scalable models of the system hardware including the device hardware and the environment it evolves in. Unlike traditional software methods, virtual platforms combine execution speed, early availability, controllability, observability, and determinism with pre- and post-silicon usability. CoWare Virtual Platforms running Windows Embedded CE will enable companies to quickly develop software for a wide range of innovative devices for office automation, mobile communications, digital TV, and more. To see a demonstration of a CoWare Virtual Platform running Windows Embedded CE, contact the CoWare office nearest you.
About the Microsoft Windows Embedded Partner Program
The Microsoft Windows Embedded Partner Program consists of more than 1,500 partners in 55 countries worldwide. The program provides partnering and co-marketing opportunities to companies delivering products, services, or solutions based on Microsoft Windows Embedded Platforms.
About CoWare
CoWare is the leading supplier of platform-driven electronic system-level (ESL) design software and services. CoWare offers a comprehensive set of ESL tools that enable electronics companies to "differentiate by design" through the creation of system IP including embedded processors, on-chip buses, and DSP algorithms; the architecture of optimized SoC platforms; hardware/software co-design; and virtual platforms for device software development. The company's solutions are based on open industry standards including SystemC. CoWare's customers are major systems, semiconductor, and IP companies in the market where consumer electronics, computing, and communications converge. CoWare's corporate investors include ARM [(LSE: ARM); (NASDAQ: ARMHY)], Cadence Design Systems (NASDAQ: CDNS), STMicroelectronics (NYSE: STM), and Sony Corporation (NYSE: SNE). CoWare is headquartered in San Jose, Calif., and has offices around the world. For more information about CoWare and its products and services, visit http://www.coware.com.
|
Related News
- CoWare and Carbon Design Systems Team to Accelerate Availability of Virtual Hardware Platforms for Architecture Design and Software Development
- CoWare Virtual Platforms Transform Enterprise Go-to-Market Strategies and Software Development Methodologies
- CoWare and Tenison Accelerate Creation of Virtual Hardware Platforms for Architectural Exploration and Software Development
- Virtio and Mentor Graphics Offer Virtual Platforms for Software Development Through The Embedded Technology Adoption Program
- UltraSoC embedded analytics and Imperas virtual platforms combine to enhance multicore development and debug
Breaking News
- Jury is out in the Arm vs Qualcomm trial
- Ceva Seeks To Exploit Synergies in Portfolio with Nano NPU
- Synopsys Responds to U.K. Competition and Markets Authority's Phase 1 Announcement Regarding Ansys Acquisition
- Alphawave Semi Scales UCIe™ to 64 Gbps Enabling >20 Tbps/mm Bandwidth Density for Die-to-Die Chiplet Connectivity
- RaiderChip Hardware NPU adds Falcon-3 LLM to its supported AI models
Most Popular
E-mail This Article | Printer-Friendly Page |