Cortina and Xilinx Connect at 40Gbps Using Interlaken
Interlaken Connection Delivers 40Gbps Effective Bandwidth Between Xilinx Virtex-5 FPGAs and Cortina CS3477 Ethernet Aggregator
SUNNYVALE, Calif. & SAN JOSE, Calif. -- January 24, 2007 -- Cortina Systems® (Cortina) and Xilinx, Inc. (Nasdaq:XLNX) today announced successful interoperability of the Virtex™-5 FPGA and Cortina’s new CS3477 Ethernet MAC aggregation IC, via the Interlaken protocol. Interlaken, an open specification for high-speed chip-to-chip packet transfers using the latest serial technology, enables component manufactures to scale their devices to 40 Gbps and beyond.
“Designers need maximum interconnect performance and many of our communications customers have been asking for technologies like Interlaken to break the bandwidth ceiling imposed by SPI.4,” said Per Holmberg, director of programmable digital systems at Xilinx. “Interlaken leverages the advanced serial transceiver technology introduced with our 65-nm Virtex-5 FPGAs last year, providing 40 Gigabits today with a runway up to 100 Gigabits or more. With Sarance Technologies previous announcement of their IP for our Virtex-5 family, a completely verified solution is available now.”
“This announcement further demonstrates Interlaken’s ability to eliminate bandwidth restrictions and increase performance for communications applications that require the highest possible performance,” said Fred Olsson, Product Manager at Cortina Systems. “We have seen an outpouring of industry support for Interlaken since its launch just a few months ago, and we are very pleased to welcome Xilinx as a member in the Interlaken eco-system.”
This demonstration connected the data from four wire-speed 10Gb/s Ethernet ports across a Xilinx FPGA and a Cortina CS3477 device.
VIRTEX-5
Built upon the industry’s most advanced 65nm triple-oxide technology, breakthrough new ExpressFabric™ technology, low-power serial transceivers, and proven ASMBL™ architecture, the Virtex-5 family represents the fifth generation in the award-winning Virtex product line. Key design team innovations in process technology, architecture and product development methodology have led to unprecedented performance and density gains with Virtex-5 FPGAs while consuming 45 percent less area than previous generation 90nm FPGAs. Initial shipments of the Virtex-5 LX and LXT Platforms began in 2006 with future platforms to follow. For more information visit www.xilinx.com/virtex5.
CS3477
Cortina’s new CS3477 Ethernet MAC aggregation IC meets the demand for higher-speed Ethernet network equipment by delivering four 10Gbps Ethernet ports to provide industry-leading 40Gbps Gigabit Ethernet aggregation for both line rate as well as oversubscribed systems. It simplifies design with four on-board XFI serdes for direct connection to XFP optical modules and connects up using the new high speed interface Interlaken.
About Xilinx
Xilinx, Inc. (Nasdaq:XLNX) is the worldwide leader of programmable logic solutions. Additional information about Xilinx is available at www.xilinx.com.
About Cortina Systems
Cortina Systems, is a leading supplier of intelligent communication solutions through continuous innovations in advanced port processing and intelligent port connectivity to the Core, Metro, Access and Enterprise Market Segments. With our state of the art high speed analog digital integration, we deliver a wide suite of products that address our customers’ performance, density and flexibility needs enabling faster time to- market, longer time-in-market, and increased revenue opportunities. Working closely with our customers to understand their system requirements and anticipate their needs, we are creating the foundation ingredients for new generations of services.
|
Xilinx, Inc. Hot IP
Related News
- Sarance Technologies Delivers Interlaken Protocol IP Core for Xilinx Virtex-5 FPGAs
- Altera, Sarance Technologies and Cortina Systems Join Forces on First Interlaken Protocol IP Core for FPGAs
- Synopsys Announces Industry's First Ultra Ethernet and UALink IP Solutions to Connect Massive AI Accelerator Clusters
- M31 Promotes Advanced SoC Development and Innovation at Intel Foundry's Direct Connect Event
- Ceva Extends its Connect IP Portfolio with Wi-Fi 7 Platform for High-End Consumer and Industrial IoT
Breaking News
- Jury is out in the Arm vs Qualcomm trial
- Ceva Seeks To Exploit Synergies in Portfolio with Nano NPU
- Synopsys Responds to U.K. Competition and Markets Authority's Phase 1 Announcement Regarding Ansys Acquisition
- Alphawave Semi Scales UCIe™ to 64 Gbps Enabling >20 Tbps/mm Bandwidth Density for Die-to-Die Chiplet Connectivity
- RaiderChip Hardware NPU adds Falcon-3 LLM to its supported AI models
Most Popular
E-mail This Article | Printer-Friendly Page |