English
ST decides to import CMOS, change Crolles function
Peter Clarke, EE Times
(01/25/2007 9:15 AM EST)
LONDON — Carlo Bozotti, chief executive officer of STMicroelectronics NV, told analysts Wednesday (Jan. 24) that ST would align with "industry leaders" to obtain a 32-nm CMOS process for use in its wafer fabs and as a platform for specialized extensions.
Bozotti did not say who would provide ST with its 32-nm CMOS platform but said: "It is obvious we have alternatives."
At present ST is aligned with leading foundry, Taiwan Semiconductor Manufacturing Co. Ltd. which is an associate partner to ST, Freescale Semiconductor Inc. and NXP BV in the Crolles2 R&D alliance.
Speaking during a conference call for analysts Bozotti said that the Crolles2 Alliance would complete the development of 45-nm CMOS process technology during 2007 but there would then be a "discontinuation" in the role of the Crolles development center and pilot fab.
(01/25/2007 9:15 AM EST)
LONDON — Carlo Bozotti, chief executive officer of STMicroelectronics NV, told analysts Wednesday (Jan. 24) that ST would align with "industry leaders" to obtain a 32-nm CMOS process for use in its wafer fabs and as a platform for specialized extensions.Bozotti did not say who would provide ST with its 32-nm CMOS platform but said: "It is obvious we have alternatives."
At present ST is aligned with leading foundry, Taiwan Semiconductor Manufacturing Co. Ltd. which is an associate partner to ST, Freescale Semiconductor Inc. and NXP BV in the Crolles2 R&D alliance.
Speaking during a conference call for analysts Bozotti said that the Crolles2 Alliance would complete the development of 45-nm CMOS process technology during 2007 but there would then be a "discontinuation" in the role of the Crolles development center and pilot fab.
|
E-mail This Article | 
|
|
Printer-Friendly Page |
Related News
- Silvaco Expands its Victory TCAD and Digital Twin Modeling Platform to Planar CMOS, FinFET and Advanced CMOS Technologies
- Semiwise, sureCore, and Cadence Showcase Breakthrough in Cryogenic CMOS Circuit Development for Quantum Computing and Energy-Efficient Data Centers
- Zhuhai Chuangfeixin: OTP IP Based on 90nm CMOS Image Sensor Process Technology Successfully Mass-Produced
- Andes Technology and MetaSilicon Collaborate to Build the World's First Automotive-Grade CMOS Image Sensor Product Using RISC-V IP SoC
- ST Engineering Acquires D'Crypt to Strengthen its Cyber Capabilities
Breaking News
- Ubitium Debuts First Universal RISC-V Processor to Enable AI at No Additional Cost, as It Raises $3.7M
- TSMC drives A16, 3D process technology
- Frontgrade Gaisler Unveils GR716B, a New Standard in Space-Grade Microcontrollers
- Blueshift Memory launches BlueFive processor, accelerating computation by up to 50 times and saving up to 65% energy
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
Most Popular
- Cadence Unveils Arm-Based System Chiplet
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Esperanto Technologies and NEC Cooperate on Initiative to Advance Next Generation RISC-V Chips and Software Solutions for HPC
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- Arteris Selected by GigaDevice for Development in Next-Generation Automotive SoC With Enhanced FuSa Standards