Motorola Expands Strategic Relationship With Texas Instruments to Include High-Volume 3G, WiMAX and OMAP(TM) Technologies
LIBERTYVILLE, Ill., and DALLAS -- Jan. 29, 2007 -- Motorola, Inc. (NYSE: MOT - News), a global leader in mobile communications and seamless mobility solutions, and Texas Instruments Incorporated (TI), a global leader in silicon solutions for wireless communications, today announced that the companies are expanding their strategic relationship to include 3G, WiMAX and OMAP(TM) technologies in the design and development of new, experience-optimized mobile devices. The expanded relationship covers current, emerging and next-generation wireless standards and leverages intellectual property from both Motorola and TI.
As part of the expansion, Motorola is developing 3G handsets based on a TI customized 3G solution that will include high-performance, power-efficient processors from TI's OMAP 3 architecture, as well as advanced, unique 3G and 3.5G building blocks from both Motorola and TI. New handsets using this solution are expected to be available to consumers as early as 2008.
Additionally, TI is supporting Motorola's mobile WiMAX initiative, including development of a customized Motorola WiMAX solution, and providing digital design elements, high-performance analog components, RF solutions, and manufacturing process and fabrication expertise. The solution will focus on core 802.16e mobile WiMAX functionality supporting voice, video and data for low-power mobile applications. The solution will be manufactured in 65nm and is expected to be ready to support production of new mobile devices that Motorola plans to launch during 2008.
"Motorola is working aggressively to design and deliver the world's most comprehensive portfolio of mobile devices that unite market-leading 'must have' design with fully optimized and unmatched 'must do' experiences," said Ron Garriques, executive vice president of Motorola and president of Motorola's Mobile Devices business. "TI is a highly valued supplier, and I am excited about the opportunities that we are pursuing together. Both of our companies are proven pioneers of innovation. Through our close collaboration on chipset technology, Motorola has developed mobile devices that are not only feature rich and affordable but also aspirational. Today's announcement significantly expands what Motorola will be bringing to market in the future."
To meet the growing need for affordable multimedia-rich capabilities in handsets, Motorola has also selected solutions from TI's OMAP 2 and OMAP 3 product portfolio and OMAP-Vox(TM) family, including the OMAPV1035 GSM/GPRS/EDGE single-chip solution from the "eCosto" platform and the OMAPV1030 GSM/GPRS/EDGE chipset. Motorola plans to use the OMAPV1035 solution, which leverages TI's innovative DRP(TM) technology, in new low-cost multimedia mobile devices expected to be in the market in 2008. Motorola also plans to use the OMAPV1030 chipset in new mid-range multimedia mobile devices expected to be in the market later this year.
"Motorola is a market leader committed to delivering innovative handsets that address the growing wireless landscape," said Rich Templeton, president and CEO of TI. "TI is delighted to expand its strong relationship with Motorola as we work closely with them to deliver the products and solutions they need. From 2.5G to 3G to the next generation of wireless standards such as WiMAX, Motorola's diverse market requirements fit well with the depth and strength of TI's proven product portfolio."
About Motorola
Motorola is known around the world for innovation and leadership in wireless and broadband communications. Inspired by our vision of seamless mobility, the people of Motorola are committed to helping you connect simply and seamlessly to the people, information, and entertainment that you want and need. We do this by designing and delivering "must have" products, "must do" experiences and powerful networks -- along with a full complement of support services. A Fortune 100 company with global presence and impact, Motorola had sales of US $42.9 billion in 2006. For more information about our company, our people and our innovations, please visit http://www.Motorola.com .
About Texas Instruments - Making Wireless
TI is the leading manufacturer of wireless semiconductors, delivering the heart of today's wireless technology and building solutions for tomorrow. TI provides a breadth of silicon and software and 15 years of wireless systems expertise that spans handsets and base stations for all communications standards, wireless LAN, Bluetooth, A-GPS, mobile TV and Ultra Wideband. TI offers custom to turn-key solutions, including complete chipsets and reference designs, OMAP(TM) application processors, as well as core digital signal processor and analog technologies built on advanced semiconductor processes. Please visit http://www.ti.com/wirelesspressroom for additional information.
About Texas Instruments
Texas Instruments Incorporated provides innovative DSP and analog technologies to meet our customers' real world signal processing requirements. In addition to Semiconductor, the company includes the Education Technology business. TI is headquartered in Dallas, Texas, and has manufacturing, design or sales operations in more than 25 countries.
Texas Instruments is traded on the New York Stock Exchange under the symbol TXN. More information is located on the World Wide Web at http://www.ti.com .
|
Related News
- Texas Instruments expands licensing agreements with Imagination Technologies to include POWERVR Series6 next generation high-performance graphics processor core
- Texas Instruments OMAP(TM) 3 hardware reference platform to increase open source innovation on the Symbian platform
- Texas Instruments Adopts Sonics SMART Interconnect(TM) Solutions for OMAP(TM) 3430 Application Processor
- Cypress Qualifies PSoC(TM) Mixed Signal Array in High-Volume Minnesota Fab 4
- New Cyclone II Device Family Expands Altera's Leadership in Low-Cost, High-Volume FPGA Market
Breaking News
- TSMC drives A16, 3D process technology
- Frontgrade Gaisler Unveils GR716B, a New Standard in Space-Grade Microcontrollers
- Blueshift Memory launches BlueFive processor, accelerating computation by up to 50 times and saving up to 65% energy
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
Most Popular
- Cadence Unveils Arm-Based System Chiplet
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Esperanto Technologies and NEC Cooperate on Initiative to Advance Next Generation RISC-V Chips and Software Solutions for HPC
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- Arteris Selected by GigaDevice for Development in Next-Generation Automotive SoC With Enhanced FuSa Standards
E-mail This Article | Printer-Friendly Page |