English
CEVA to Showcase Continued Leadership in Intellectual Property for Wireless Handset Applications at 3GSM World Congress 2007
Silicon-Proven Multimedia, Voice-over-IP and Audio Development Platforms Highlight CEVA's Extensive Commitment to Provide Complete One-Stop-Shop Licensable Solutions for Mobile Devices
SAN JOSE, Calif., Jan. 31, 2007 -- CEVA, Inc. (Nasdaq: CEVA - News; LSE: CVA - News), a leading licensor of innovative intellectual property (IP) platform solutions and DSP cores for wireless, consumer and multimedia applications, will be demonstrating a comprehensive range of complete hardware and software platform IP solutions aimed at mobile devices during 3GSM World Congress in Barcelona, Spain (12-15 February 2007), at Stand 2F07, Hall 2.
All IP solutions that CEVA will be demonstrating at 3GSM incorporate CEVA's industry-leading DSP cores, providing an easy migration path for existing customers wanting to integrate leading-edge applications into their handset designs. New licensees benefit from CEVA's "complete solution" approach to IP in which all the necessary hardware and software application IP is provided by CEVA. A single-source provider allows product developers to easily incorporate a range of new technologies into their system-on-chips (SoCs), offering them cost, power and time-to-market benefits.
CEVA will demonstrate the following portfolio of products at 3GSM 2007:
High-performance and flexible DSP and platform solutions to be demonstrated by CEVA Technology Partners during 3GSM include: a video-over-UMTS solution utilizing the CEVA-X1620(TM) DSP core; Smartphone and Karaoke video and audio platforms that incorporate CEVA-TeakLite-II DSP cores; and a CEVA Technology Partner utilizing the CEVA-X1641(TM) Quad-MAC DSP core for its latest generation of WiMAX baseband processors.
About CEVA, Inc.
Headquartered in San Jose, Calif., CEVA is a leading licensor of innovative intellectual property (IP) platform solutions and DSP cores for wireless, consumer and multimedia applications. CEVA's IP portfolio includes comprehensive platform solutions for multimedia, audio, voice over packet (VoP), Bluetooth, Serial Attached SCSI (SAS) and Serial ATA (SATA), and a wide range of programmable DSP cores and subsystems with different price/performance metrics serving multiple markets. In 2006, CEVA's IP was shipped in over 190 million devices. For more information, visit http://www.ceva-dsp.com/ . Visit CEVA in Stand 2F07, Hall 2 at 3GSM
SAN JOSE, Calif., Jan. 31, 2007 -- CEVA, Inc. (Nasdaq: CEVA - News; LSE: CVA - News), a leading licensor of innovative intellectual property (IP) platform solutions and DSP cores for wireless, consumer and multimedia applications, will be demonstrating a comprehensive range of complete hardware and software platform IP solutions aimed at mobile devices during 3GSM World Congress in Barcelona, Spain (12-15 February 2007), at Stand 2F07, Hall 2.
All IP solutions that CEVA will be demonstrating at 3GSM incorporate CEVA's industry-leading DSP cores, providing an easy migration path for existing customers wanting to integrate leading-edge applications into their handset designs. New licensees benefit from CEVA's "complete solution" approach to IP in which all the necessary hardware and software application IP is provided by CEVA. A single-source provider allows product developers to easily incorporate a range of new technologies into their system-on-chips (SoCs), offering them cost, power and time-to-market benefits.
CEVA will demonstrate the following portfolio of products at 3GSM 2007:
- Mobile-Media2000(TM)
Targeted at mobile multimedia applications for handheld devices such as smartphones, wireless PDA's, Portable Media Players and Portable Navigation Devices, Mobile-Media2000 is a fully programmable solution supporting a broad range of audio and video encoders and decoders including MPEG4, H.264, VC-1, WMV, WMA, AAC, HE-AAC and more up to SD resolution at 30 frames per second (fps). Mobile-Media2000 incorporates all the technologies required to deliver a total solution for SoC developers, including a complete DSP-based hardware platform, optimized software codecs and Software Development Kits (SDK) including advanced middleware (3GPP File Formats and streaming protocol). Customers licensing Mobile-Media2000 can reuse this single platform across multiple products and markets providing a cost-effective, low power, programmable DSP-based solution. In addition to supporting virtually any multimedia codec, the embedded CEVA-X1620 DSP core provides the ability to run any general software in addition to the multimedia DSP code, offering the semiconductor vendor a highly flexible solution with die size, cost and power benefits.
At the show, CEVA will be demonstrating the Mobile-Media2000 full solution running full software solution for advanced codecs such as H.264 and MPEG4 at SD resolution, 30fps.
At the show, CEVA will be demonstrating the Mobile-Media2000 full solution running full software solution for advanced codecs such as H.264 and MPEG4 at SD resolution, 30fps.
- CEVA-VoP(TM)
CEVA-VoP is a fully integrated Voice-over-Packet (VoP) platform solution targeted at residential and consumer markets. Enabled by CEVA's Xpert-TeakLite-II(TM) subsystem, the platform integrates CEVA's broadly used, programmable TeakLite-II(TM) DSP core, with added system peripherals capable of handling multiple, simultaneous, packet-voice channels on a single core. It includes a fully integrated VoIP software suite, integrating speech compression and decompression, echo cancellation, telephony functions, and signaling/networking. The incorporated software is open, allowing design licensees to add proprietary algorithms and broaden the use of the design to other markets or applications. CEVA-VoP can be deployed as a subsystem in an integrated networking and VoP System-on-Chip.
At the show, CEVA will be demonstrating the CEVA-VoP full solution running all the VoIP telephony functions on a single TeakLite-II(TM) DSP core, including the networking functions.
At the show, CEVA will be demonstrating the CEVA-VoP full solution running all the VoIP telephony functions on a single TeakLite-II(TM) DSP core, including the networking functions.
- CEVA-Audio(TM)
Targeting high-volume markets such as portable audio players, Smartphones and home theatre systems (digital TVs and Set Top Boxes), CEVA-Audio is a low-power, low-cost DSP-based platform that combines several CEVA-developed technologies including the CEVA-TeakLite-II DSP core, a cache memory subsystem, audio peripherals, a comprehensive set of audio codecs (MP3, WMA, AAC, HE-AAC, Ogg Vorbis, BSAC, NB-AMR and WB-AMR) and complete tool chain support.
At the show, CEVA will be demonstrating a CEVA-TeakLite-II based silicon platform running various Audio codecs such as MP3 and WMA decoding with an MMC Flash card as the music source.
At the show, CEVA will be demonstrating a CEVA-TeakLite-II based silicon platform running various Audio codecs such as MP3 and WMA decoding with an MMC Flash card as the music source.
High-performance and flexible DSP and platform solutions to be demonstrated by CEVA Technology Partners during 3GSM include: a video-over-UMTS solution utilizing the CEVA-X1620(TM) DSP core; Smartphone and Karaoke video and audio platforms that incorporate CEVA-TeakLite-II DSP cores; and a CEVA Technology Partner utilizing the CEVA-X1641(TM) Quad-MAC DSP core for its latest generation of WiMAX baseband processors.
About CEVA, Inc.
Headquartered in San Jose, Calif., CEVA is a leading licensor of innovative intellectual property (IP) platform solutions and DSP cores for wireless, consumer and multimedia applications. CEVA's IP portfolio includes comprehensive platform solutions for multimedia, audio, voice over packet (VoP), Bluetooth, Serial Attached SCSI (SAS) and Serial ATA (SATA), and a wide range of programmable DSP cores and subsystems with different price/performance metrics serving multiple markets. In 2006, CEVA's IP was shipped in over 190 million devices. For more information, visit http://www.ceva-dsp.com/ . Visit CEVA in Stand 2F07, Hall 2 at 3GSM
|
||||||
Ceva, Inc. Hot IP
Related News
- CEVA to Showcase Continued Leadership in IP for Wireless Handset Applications at 3GSM World Congress 2006
- CEVA to Showcase Leadership in Mobile DSP Technologies for Advanced Communication and Multimedia Applications at Mobile World Congress 2012
- CEVA Leads the Way at Mobile World Congress 2008 With Industry Leading Portfolio of Mobile Intellectual Property
- Wipro-NewLogic Reinforces Its Worldwide Leadership in Bluetooth and Wireless LAN Intellectual Property
- CEVA to Demonstrate Software-Based H.264 and GPS Technologies for Wireless Devices at 3GSM World Congress 2005
Breaking News
- intoPIX Powers Ikegami's New IPX-100 with JPEG XS for Seamless & Low-Latency IP Production
- Tower Semiconductor and Alcyon Photonics Announce Collaboration to Accelerate Integrated Photonics Innovation
- Qualcomm initiates global anti-trust complaint about Arm
- EnSilica Agrees $18m 7 Year Design and Supply ASIC Contract
- SiliconIntervention Announces Availability of Silicon Based Fractal-D Audio Amplifier Evaluation Board
Most Popular
- Qualcomm initiates global anti-trust complaint about Arm
- Siemens acquires Altair to create most complete AI-powered portfolio of industrial software
- Alphawave Semi Reveals Suite of Optoelectronics Silicon Products addressing Hyperscaler Datacenter and AI Interconnect Market
- EnSilica Agrees $18m 7 Year Design and Supply ASIC Contract
- Rapidus Announces Strategic Partnership with Quest Global to Enable Advanced 2nm Solutions for the AI Chip Era
|
E-mail This Article | 
|
|
Printer-Friendly Page |