Ricoh Selects SonicsMX(R) SMART Interconnect(TM) Solution for Its Image Processing Platform SoC Strategy
MOUNTAIN VIEW, Calif.--February 22, 2007--Sonics Inc.®, a premier supplier of system-on-chip (SoC) SMART Interconnect(TM) solutions, today announced that Ricoh Company, Ltd. has selected the SonicsMX SMART Interconnect solution as the foundation for an image processing platform SoC strategy that will be used for several multi-function printer (MFP) applications.
The agreement with Ricoh marks an expansion of Sonics' customer base that now includes marquee original equipment manufacturers as well as marquee semiconductor companies. Ricoh's decision also highlights the continuing trend to shift from processor-centric SoC to interconnect-centric or platform SoC solutions in order to achieve high reuse of key intellectual property components for multiple projects while saving time and money on a per project basis. Sonics SMART Interconnect solutions offer OEMs, such as Ricoh, an economical and straight forward transition to the platform SoC strategy.
"As system functions are rapidly converging onto a single SoC, a platform SoC strategy is becoming a key ingredient for original equipment manufacturers to remain competitive," says Tetsuya Morita, general manager, controller development center, MFP business group, Ricoh Company, Ltd. "An interconnect-centric platform SoC strategy, based on SonicsMX, enables Ricoh to add significant flexibility into our SoC design process and accommodate more aggressive software development, which is where we can differentiate."
Ricoh will utilize SonicsMX as the foundation for SoCs responsible for ultra-high pixel processing. High-end MFP requirements, such as high resolution, multiple colors and multiple image formats are among the most demanding digital imaging processing requirements today. The non-blocking nature of SonicsMX, along with an extensive suite of data flow services available, and the ability to achieve maximum external DRAM bandwidth enables Ricoh to mix parallel processing techniques with high utilization for each of the processing elements contained in the SoC. This provides software developers with the significant hardware price-performance advantage necessary to achieve algorithm and application level differentiation.
The widespread use of SonicsMX among top semiconductor companies gives Sonics a unique advantage to help OEMs make the transition to platform SoCs, because Sonics offers complete products, has vast system knowledge and a well-established track record for helping its customers gain significant market-leading positions.
With over 100 million units shipped, Sonics SMART Interconnect solutions have been used in some of the world's leading-edge high-end SoCs, such as Texas Instruments' OMAP application processors for cell phones, HDTV chips developed by Samsung for LCD-based HDTVs, as well as office automation and automotive video processing applications. Market leaders have adopted the SonicsMX® SMART Interconnect(TM) solution to improve time-to-market, reduce design risks and leverage a high degree of platform-based design flexibility. Sonics also recently announced SonicsLX(TM), a new SMART Interconnect solution aimed at mid-range SoCs.
About Sonics
Sonics Inc. is a premier supplier of SMART Interconnect solutions that deliver high SoC design predictability and increased design efficiency. Major semiconductor and systems companies including Broadcom, Samsung, Texas Instruments and Toshiba have applied Sonics' SMART Interconnect solutions in leading products in the wireless, digital multimedia and communications markets. Sonics is a privately-held company funded by Cadence Design Systems, Toshiba Corporation, Samsung Ventures and venture capital firms Investar Capital, Smart Technology Ventures, TL Ventures, Easton Hunt Capital, JAFCO Ventures, and H&Q Asia-Pacific. For more information, see www.sonicsinc.com
About Ricoh
A global leader in digital office solutions, Ricoh (www.ricoh.com) creates new value at the interface of people and information, offering a broad range of digital, networked products, including multifunction products, printers, fax machines, DVD/CD media, and digital cameras.
|
Related News
- MIPS Technologies Unveils New SOC-it(R) Platform Strategy for MIPS-Based(TM) SoCs
- Mentor Graphics Offers Sonics(R) SMART Interconnect(TM) Solutions
- Tata Elxsi Adopts SonicsMX SMART Interconnect Solution for Its Digital Media Solutions Platform
- Socionext to Showcase Leading-Edge Technologies at CES 2024, Featuring Custom SoC Solutions, Low Power Sensors, Smart Display Controller, and Advanced Image Processor
- CEVA and LG Partner to Bring Intelligent Vision Processing to Smart Home Appliances
Breaking News
- Intel brings 3nm production to Europe in 2025
- RISC-V in Space Workshop 2025 in Gothenburg
- VeriSilicon introduces AcuityPercept: an AI-powered automatic ISP tuning system
- Avant Technology Partners with COSEDA Technologies to Enhance System-Level Software Solutions
- Tower Semiconductor and Alcyon Photonics Announce Collaboration to Accelerate Integrated Photonics Innovation
Most Popular
- Qualcomm initiates global anti-trust complaint about Arm
- Sarcina Technology launches AI platform to enable cost-effective customizable AI packaging solutions
- EnSilica Agrees $18m 7 Year Design and Supply ASIC Contract
- Siemens to accelerate customer time to market with advanced silicon IP through new Alphawave Semi partnership
- Tower Semiconductor and Alcyon Photonics Announce Collaboration to Accelerate Integrated Photonics Innovation
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |