BOPS Appoints Zafar Malik as Vice President of Design Services
High-Performance Core Provider Enhances Design Services Organization To Service Its Growing Customer Base
MOUNTAIN VIEW, Calif., June 5, 2000 -- BOPS, Inc., a leading programmable DSP core provider, today announced that the company has appointed Zafar Malik as vice-president of design services. Malik joins BOPS executive team and is responsible for providing design services to BOPS' customers.
BOPS develops and licenses high-performance DSP cores as well as providing top tier OEMs with hardware, software tools and engineering support to quickly and efficiently design Internet, multimedia and communications products using the BOPS ManArray? DSP core family.
Carl Schlachte, BOPS CEO, remarked, "Zafar Malik's design and design management experience will greatly enhance our ability to effectively support our customers to achieve the results they require for their high-performance DSP based, System on Chip designs using our synthesizable cores for their Internet, multimedia and communications products."
Zafar Malik joins BOPS with over 20 years of design management and design experience. Most recently, he was with Hitachi Semiconductor, where he was Director of ASSP (Application Specific Standard Products) and was involved in designs using cores for the communications market. Prior to this, Malik held design and design management positions at Samsung Microelectronics, Fujitsu Microelectronics, and Texas Instruments. Malik holds a MBA degree from St. Edward's University, Austin, Texas and a MSEE degree from the University of Missouri, Columbia, Missouri.
About BOPS, Inc.
BOPS, Inc. is a Mountain View, Calif.-based company that develops and licenses high performance, scalable and reusable DSP cores and compiler and software tool products for high-volume, SOC-based applications for the Internet, multimedia and wireless communications markets.
ManArray DSP cores accelerate a SOC manufacturers? time from product concept to high-volume shipment. The ManArray technology has been designed to integrate with MIPS® and ARM? processor-based SOCs.
For information contact:
Renee Anderson
BOPS, Inc.
650 330-8410
-or-
Georgia Marszalek
BOPS PR Counsel
650 345 7477
Notes to editors:
Photo available on request
BOPS: Billions of Operations Per Second
DSP: Digital Signal Processor
SOC: Systems-on-Chip
Related News
- CoWare Appoints Allen Spence Vice-President Worldwide Services
- Xilinx Appoints Patrick Little Vice President Of Worldwide Sales & Services
- CoWare Appoints Dr. Heinz Holzapfel Vice President of New Application Services and IP Integration Organization
- Breker Verification Systems Appoints Andy Stein Vice President of Worldwide Sales as Company Scales New Business Opportunities
- MosChip Technologies Appoints Semiconductor Industry Veteran, DVR Murthy As "Vice President of Strategic Initiatives" to Implement and Execute Expanded Solution Offerings
Breaking News
- Breker RISC-V SystemVIP Deployed across 15 Commercial RISC-V Projects for Advanced Core and SoC Verification
- Veriest Solutions Strengthens North American Presence at DVCon US 2025
- Intel in advanced talks to sell Altera to Silverlake
- Logic Fruit Technologies to Showcase Innovations at Embedded World Europe 2025
- S2C Teams Up with Arm, Xylon, and ZC Technology to Drive Software-Defined Vehicle Evolution
Most Popular
- Intel in advanced talks to sell Altera to Silverlake
- Arteris Revolutionizes Semiconductor Design with FlexGen - Smart Network-on-Chip IP Delivering Unprecedented Productivity Improvements and Quality of Results
- RaiderChip NPU for LLM at the Edge supports DeepSeek-R1 reasoning models
- YorChip announces Low latency 100G ULTRA Ethernet ready MAC/PCS IP for Edge AI
- AccelerComm® announces 5G NR NTN Physical Layer Solution that delivers over 6Gbps, 128 beams and 4,096 user connections per chipset
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |