7 µW always on Audio feature extraction with filter banks on TSMC 22nm uLL
MoSys Launches New Memory Macros Specifically Configured for Mobile Handset Displays
SUNNYVALE, Calif., March 22, 2007 -- MoSys, Inc. (Nasdaq: MOSY - News), the leading provider of high-density system-on-chip (SoC) embedded memory intellectual property (IP), announced today the availability of an application-specific implementation of its industry-leading 1T-SRAM® memory IP for the cellular phone market. The MoSys 1T-SRAM Dual-Port Display macros have been designed specifically for mobile handset displays. Initial customer adoption is already underway, marking MoSys' entry into a new high-volume consumer market.
Manufacturers of mobile handsets are under increasing pressure to incorporate larger buffer memory into the display to accommodate increases in display size and pixel densities. Such increases are driven by added functionality, like video playback, gaming, and high-resolution cameras on mobile phones. The MoSys 1T-SRAM Dual-Port Display macro is used as the display buffer memory mounted on the display (chip-on-glass) or on the connecting cable (chip-on-film or tape carrier package). By keeping the display buffer memory on the display itself, mobile vendors can reduce electromagnetic interference (EMI) challenges, while cutting overall display power consumption. In these configurations, the buffer memory must conform to unusual area and form factor requirements of the display, which is easily accomplished using the MoSys 1T-SRAM technology.
Compatible with high-volume processes at major foundries and integrated device manufacturers, the MoSys 1T-SRAM Dual-Port Display macro uses standard foundry process technologies and offers a reduction in overall silicon area of up to 70 percent when compared to conventional embedded memory solutions.
Said Chet Silvestri, president and CEO of MoSys, "We continue to find ways to enable new and exciting consumer applications based on the core strength of the MoSys 1T-SRAM technology. We are seeing strong customer interest in our new MoSys Dual-Port Display macro, which is the first application-optimized memory built on our technology platform. It is already being designed into mobile handset devices."
About MoSys, Inc.
Founded in 1991, MoSys (Nasdaq: MOSY - News), develops, licenses and markets industry-leading embedded memory IP for semiconductors. MoSys' patented 1T-SRAM & 1T-FLASH technologies offer a combination of high density, low power consumption, high speed and low cost that is unmatched by other memory technologies. MoSys licensees have shipped more than 100 million chips incorporating 1T-SRAM, demonstrating excellent manufacturability in a wide range of silicon processes and applications. MoSys is headquartered at 755 N. Mathilda Avenue, Sunnyvale, California 94085. More information is available at http://www.mosys.com.
|
Related News
- Sidense OTP Memory IP Enables 65nm Mobile Handset Chip
- Mobile Handset Industry Leaders Form a Working Group to Drive New Memory Interface Standard
- Blueshift Memory launches BlueFive processor, accelerating computation by up to 50 times and saving up to 65% energy
- NEO Semiconductor Launches Ground-Breaking 3D X-DRAM Technology, A Game Changer in the Memory Industry
- eMemory and UMC Expand Low-Power Memory Solutions for AIoT and Mobile Markets with 22nm RRAM Qualification
Breaking News
- Breker RISC-V SystemVIP Deployed across 15 Commercial RISC-V Projects for Advanced Core and SoC Verification
- Veriest Solutions Strengthens North American Presence at DVCon US 2025
- Intel in advanced talks to sell Altera to Silverlake
- Logic Fruit Technologies to Showcase Innovations at Embedded World Europe 2025
- S2C Teams Up with Arm, Xylon, and ZC Technology to Drive Software-Defined Vehicle Evolution
Most Popular
- Intel in advanced talks to sell Altera to Silverlake
- Arteris Revolutionizes Semiconductor Design with FlexGen - Smart Network-on-Chip IP Delivering Unprecedented Productivity Improvements and Quality of Results
- RaiderChip NPU for LLM at the Edge supports DeepSeek-R1 reasoning models
- YorChip announces Low latency 100G ULTRA Ethernet ready MAC/PCS IP for Edge AI
- AccelerComm® announces 5G NR NTN Physical Layer Solution that delivers over 6Gbps, 128 beams and 4,096 user connections per chipset
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |