Dolphin Integration releases its RAM for 90 nm nodes with dual optimization: for ultra-low power and for extremely high density
Saving both ultra-low dynamic power and leakage, while maintaining an extremely high density, is a dream of every SoC integrator. With the announcement of its upcoming product, spRAM uLCeHD: URANUS 90LP/GP this Provider is on its way towards fulfilling this paradoxical dream.
It enables traveling with portable devices which demands these three important characteristics. The product is released at once in LP as well as in GP process and available on request at half nodes.
For more information, please visit:
http://www.dolphin.fr/flip/ragtime/90/ragtime_90_ram.html
|
Dolphin Design Hot IP
Related News
- Ultra high density standard cell library SESAME uHD-BTF to enrich Dolphin Integration's panoply at TSMC 90 nm eF and uLL
- Dolphin Integration announces its ultra low power, low leakage and High density 65 nm ROMs and RAMs
- DOLPHIN Integration releases a ROM in 65 nm with Ultra high density and ultra low leakage
- PixArt Imaging selects voltage regulators IPs from Dolphin Integration for its ultra-low power MCU Sensor in 40 nm
- Dolphin Integration enable Dongbu HiTek's users to benefit from their ultra high density standard cell library
Breaking News
- Breker RISC-V SystemVIP Deployed across 15 Commercial RISC-V Projects for Advanced Core and SoC Verification
- Veriest Solutions Strengthens North American Presence at DVCon US 2025
- Intel in advanced talks to sell Altera to Silverlake
- Logic Fruit Technologies to Showcase Innovations at Embedded World Europe 2025
- S2C Teams Up with Arm, Xylon, and ZC Technology to Drive Software-Defined Vehicle Evolution
Most Popular
- Intel in advanced talks to sell Altera to Silverlake
- Arteris Revolutionizes Semiconductor Design with FlexGen - Smart Network-on-Chip IP Delivering Unprecedented Productivity Improvements and Quality of Results
- RaiderChip NPU for LLM at the Edge supports DeepSeek-R1 reasoning models
- YorChip announces Low latency 100G ULTRA Ethernet ready MAC/PCS IP for Edge AI
- AccelerComm® announces 5G NR NTN Physical Layer Solution that delivers over 6Gbps, 128 beams and 4,096 user connections per chipset
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |