VinChip Systems announces USB PHY Verification Services
San Jose, CA. April 9,2007 -VinChip Systems one of the leaders in USB IP licensing announced immediate availability of PHY Verification Services to address the growing need to validate USB PHY before silicon and post tape out
Home grown or third party USB PHY (UTMI/UTMI+/ULPI) can be tested with VinChip Verification IP containing silicon proven VinChip RTL and test environment to identify bugs early in the design . Customers can get full access to VinChip RTL and full test case database as a part of this service. Post silicon customer’s PHY will be tested in VinChip FPGA emulation environment and checked for USB – IF compliance
“Our engagement with early Beta customers helped us to validate our VIP with third party PHY model” commented Murugesan Jeyachandran, VP Engineering VinChip Systems. “VinChip today has successfully interoperated its IP with more than 10 different PHY offerings that are available in the market today” he added
VinChip Systems USB Intellectual Property is being used by more than 60 customers worldwide today. Deliverables include Verilog or VHDL models along with directed and random test bench verification environment. For more information on this service please contact info@vinchip.com
|
VinChip Systems Hot IP
Related News
- VinChip announces USB 3.0 Verification IP for Super Speed USB Devices
- Synopsys Announces Complete SuperSpeed USB IP Solution Consisting of Device Controller, PHY and Verification IP
- VinChip Announces Verification Testbench for Certified Wireless USB
- Introducing USB 3.0, PCIe 2.0 and SATA 3.0 Combo PHY IP Cores to empower Next Gen Connectivity Chipsets
- Unveiling Silicon-proven USB 3.0 PHY IP Core in 22nm, Elevating High-Speed Data Transmission with Advanced Transceiver Technology, backward compatible with USB 2.0
Breaking News
- Intel brings 3nm production to Europe in 2025
- RISC-V in Space Workshop 2025 in Gothenburg
- VeriSilicon introduces AcuityPercept: an AI-powered automatic ISP tuning system
- Avant Technology Partners with COSEDA Technologies to Enhance System-Level Software Solutions
- Tower Semiconductor and Alcyon Photonics Announce Collaboration to Accelerate Integrated Photonics Innovation
Most Popular
- Qualcomm initiates global anti-trust complaint about Arm
- Sarcina Technology launches AI platform to enable cost-effective customizable AI packaging solutions
- EnSilica Agrees $18m 7 Year Design and Supply ASIC Contract
- Siemens to accelerate customer time to market with advanced silicon IP through new Alphawave Semi partnership
- Tower Semiconductor and Alcyon Photonics Announce Collaboration to Accelerate Integrated Photonics Innovation
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |