Global Unichip Completes First Successful 65nm Tape-Out in Taiwan

Design with major global digital camera vendor marks first of four planned 65 nm tape-outs in first half of 2007

Hsin-Chu, Taiwan -- April 20, 2007 -- Global Unichip Corp. (GUC) (TAIEX: 3443), a leading SoC design service and total solution provider, today announced that it has accomplished the first successful 65nm tape-out in Taiwan. The project is for a digital camera from a major global brand.

@@This successful tape-out marks the first of four 65 nm tape-outs planned by GUC in the first half of 2007. The company is also planningtwo testchip tape-outs in 45nm before the end of 2007. Additionally, projects using GUCfs 90nm process will begin mass production later this year.

@@gWe are very proud to be the first company in Taiwan to successfully complete a 65nm tape-out,h stated K.C. Shih, founder and CEO of Global Unichip. gGUCfsproven achievements in advanced technology demonstrateour capability to handle complicated SoC design projects and also to provide the best turn-key services for our customers.h

@@gAs consumer electronics become smaller and lighter, designing a multi-function, low-power system in a small form factor is a major challenge for todayfs IC designers,h said Jim Lai, president and COO of Global Unichip. gGUCfs expertise in managing necessary logistic flows, coupled with its position in the integrated IC supply chain, will help customers meet these increasing demands with a short time-to-market and first run silicon success.h

@@GUCfs designs target applications in consumer electronics, communications and computing, including:networking, GPS, mobile phones, TV, DV camcorder, surveillance systems, WiMax and more.

About Global Unichip

Global Unichip Corp. (GUC), a dedicated full service SoC (System-On-Chip) Design Foundry based in Taiwan, was founded in 1998. GUC provides total solutions from silicon-proven IPs to complex time-to-market SoC turnkey services. GUC is committed to providing the most advanced and best price-performance silicon solutions through close partnerships with TSMC, a major GUC shareholder, and other key packaging and testing powerhouses. With state-of-the-art EDA tools, advanced methodologies and an experienced technical team, GUC ensures the highest quality and lowest risks to achieve first silicon success. GUC has established a global customer base throughout Greater China, Japan, Korea, North America and Europe. Its track record in complex SoC designs benefits customers in time-to-revenue at the lowest risk.