TI Makes ZigBee Available for Mass Market with Free Software Stack
DALLAS -- April 19, 2007 -- Texas Instruments Incorporated (TI) (NYSE: TXN) today announced the release of their industry leading ZigBeeTM stack, Z-Stack, for free download at www.ti.com/zigbee. Z-Stack has been awarded the ZigBee Alliance golden unit status by the ZigBee test house TÜV Rheinland and is used by thousands of ZigBee developers worldwide. Z-Stack is compliant with the ZigBee 2006 specification and supports multiple platforms including the CC2430 System-on-Chip solution for IEEE 802.15.4/ZigBee and a new platform based on the CC2420 transceiver and TI's MSP430 ultra-low-power microcontrollers (MCUs).
In addition to being fully compliant with the ZigBee 2006 specification, Z-Stack supports new extended features like over-the-air-download, which allows updates of nodes wirelessly over a ZigBee mesh network. Z-Stack also supports the CC2431 which features location awareness. This enables the users to create new ZigBee applications that can change behavior based on the nodes' current location.
"The MSP430 is the leading low-power MCU family and is already used in many wireless networking solutions. It is a great complement to the CC2430 SoC and gives our customers great flexibility in selecting the optimal solution for their application," said Kobus Marneweck, general manager, low-power RF software development at TI.
In conjunction with the Z-Stack release, TI is also re-introducing the company's ZigBee Development Kits. The price of the development kits has been reduced to enable more designers to evaluate TI's ZigBee solution.
"ZigBee is not only an excellent solution for large OEMs but also for smaller companies who require a wireless link in their products," added Kobus Marneweck. "Running the Z-Stack on a module from one of our development partners is an easy way to add wireless networking to a product without the need for extensive knowledge in RF or wireless networking protocols."
TI's Low-Power RF Developer Network enables customers to find a suitable partner to assist with hardware design, modules, embedded software, gateways, commissioning tools, etc. The Low-Power RF Developer Network consists of recommended companies, RF consultants, and independent design houses that provide a series of hardware module products and design services. See www.ti.com/lprfnetwork.
Z-Stack and the Low-Power RF Developer Network are part of TI's wide-ranging support infrastructure for engineers that includes training and seminars, design tools and utilities, technical documentation, evaluation modules, an online KnowledgeBase, a product information hotline and a comprehensive offering of samples that ship within 24 hours of request. For more information on TI's complete analog design support, see www.ti.com/analogelab.
|
Related News
- Dolphin Integration makes available in free download its innovative IDE SmartVision, for the RISC-V ecosystem
- Telink Semiconductor's RF system on chip (SoC) passes ZigBee 3.0 certification tests using DSR's wireless software stack
- Telink Semiconductor's RF system on chip (SoC) passes ZigBee 3.0 certification tests using DSR's wireless software stack
- SeaSolve Software Inc' Automated Manufacturing Test Solution accelerates ZigBee time to market
- ARM Leads The Mobile Market Into Console-Quality 3D Gaming
Breaking News
- Breker RISC-V SystemVIP Deployed across 15 Commercial RISC-V Projects for Advanced Core and SoC Verification
- Veriest Solutions Strengthens North American Presence at DVCon US 2025
- Intel in advanced talks to sell Altera to Silverlake
- Logic Fruit Technologies to Showcase Innovations at Embedded World Europe 2025
- S2C Teams Up with Arm, Xylon, and ZC Technology to Drive Software-Defined Vehicle Evolution
Most Popular
- Intel in advanced talks to sell Altera to Silverlake
- Arteris Revolutionizes Semiconductor Design with FlexGen - Smart Network-on-Chip IP Delivering Unprecedented Productivity Improvements and Quality of Results
- RaiderChip NPU for LLM at the Edge supports DeepSeek-R1 reasoning models
- YorChip announces Low latency 100G ULTRA Ethernet ready MAC/PCS IP for Edge AI
- AccelerComm® announces 5G NR NTN Physical Layer Solution that delivers over 6Gbps, 128 beams and 4,096 user connections per chipset
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |