English
Sonics and Denali Team on Platform Approach for Consumer SoC Designs
Denali Databahn(TM) Memory Controller IP and SonicsMX(R) SMART Interconnect(TM) Solution Deliver Optimal Memory Bandwidth for Multi-Core SoCs
MOUNTAIN VIEW, Calif.--April 25, 2007 --Sonics Inc., a premier supplier of system-on-chip (SoC) SMART Interconnect solutions, and Denali Software, Inc, a leading provider of electronic design automation (EDA) software and intellectual property (IP) for system-on-chip (SoC) design and verification, today announced a collaborative effort to address memory bandwidth optimization through the pairing of Sonics SMART Interconnect solutions and Denali Databahn DDR memory controllers. Companies using both Sonics SMART Interconnect solutions and Denali's Databahn are now able to quickly and efficiently deploy memory subsystems and on-chip interconnects to deliver optimal memory bandwidth utilization for multi-core SoC designs.
"The trend toward multi-core designs adds significant complexity to the memory subsystem and interconnect design for today's SoCs," said Drew Wingard, chief technology officer, Sonics, Inc. "The SoC designer must ensure that all the processing and input/output elements in the system are served with the required levels of memory bandwidth with acceptable latency while ensuring high efficiency access to external DRAM. By teaming with Denali, we've ensured the on-chip interconnect and memory controller IP interoperate so that our mutual customers can offload much of the time and risk associated with developing these memory subsystems."
This collaboration addresses the problems associated with increasing external memory bandwidth requirements and a transition from single processor architectures to multicore architectures. As new SoC designs continue to absorb more system functionality, the need for intelligent management of memory resources become even more critical.
"Developers of consumer electronics are challenged to design complex, multi-core SoCs," said Brian Gardner, vice president of IP products at Denali. "These customers need configurable, proven solutions that can be rapidly deployed for memory subsystems and SoC interconnects. With Sonics, we are able to combine the two best-in-class solutions and meet these demanding needs."
About Sonics
Sonics Inc. is a premier supplier of SMART Interconnect solutions that deliver high SoC design predictability and increased design efficiency. Major semiconductor and systems companies including Broadcom, Samsung, Texas Instruments and Toshiba have applied Sonics' SMART Interconnect solutions in leading products in the wireless, digital multimedia and communications markets. Sonics is a privately-held company funded by Cadence Design Systems, Toshiba Corporation, Samsung Ventures and venture capital firms Investar Capital, Smart Technology Ventures, TL Ventures, Easton Hunt Capital, JAFCO Ventures, and H&Q Asia-Pacific. For more information, see www.sonicsinc.com
About Denali
Denali Software, Inc. is a world-leading provider of electronic design automation (EDA) software and intellectual property (IP) for system-on-chip (SoC) design and verification. Denali delivers the industry's most trusted solutions for deploying PCI Express, NAND and DRAM subsystems. Developers use Denali's EDA, IP and services to reduce risk and speed time-to-market for electronic system and chip design. Denali is headquartered in Palo Alto, California and has offices around the world to serve the global electronics industry. More information about Denali, its products and services is available at http://www.denali.com.
MOUNTAIN VIEW, Calif.--April 25, 2007 --Sonics Inc., a premier supplier of system-on-chip (SoC) SMART Interconnect solutions, and Denali Software, Inc, a leading provider of electronic design automation (EDA) software and intellectual property (IP) for system-on-chip (SoC) design and verification, today announced a collaborative effort to address memory bandwidth optimization through the pairing of Sonics SMART Interconnect solutions and Denali Databahn DDR memory controllers. Companies using both Sonics SMART Interconnect solutions and Denali's Databahn are now able to quickly and efficiently deploy memory subsystems and on-chip interconnects to deliver optimal memory bandwidth utilization for multi-core SoC designs.
"The trend toward multi-core designs adds significant complexity to the memory subsystem and interconnect design for today's SoCs," said Drew Wingard, chief technology officer, Sonics, Inc. "The SoC designer must ensure that all the processing and input/output elements in the system are served with the required levels of memory bandwidth with acceptable latency while ensuring high efficiency access to external DRAM. By teaming with Denali, we've ensured the on-chip interconnect and memory controller IP interoperate so that our mutual customers can offload much of the time and risk associated with developing these memory subsystems."
This collaboration addresses the problems associated with increasing external memory bandwidth requirements and a transition from single processor architectures to multicore architectures. As new SoC designs continue to absorb more system functionality, the need for intelligent management of memory resources become even more critical.
"Developers of consumer electronics are challenged to design complex, multi-core SoCs," said Brian Gardner, vice president of IP products at Denali. "These customers need configurable, proven solutions that can be rapidly deployed for memory subsystems and SoC interconnects. With Sonics, we are able to combine the two best-in-class solutions and meet these demanding needs."
About Sonics
Sonics Inc. is a premier supplier of SMART Interconnect solutions that deliver high SoC design predictability and increased design efficiency. Major semiconductor and systems companies including Broadcom, Samsung, Texas Instruments and Toshiba have applied Sonics' SMART Interconnect solutions in leading products in the wireless, digital multimedia and communications markets. Sonics is a privately-held company funded by Cadence Design Systems, Toshiba Corporation, Samsung Ventures and venture capital firms Investar Capital, Smart Technology Ventures, TL Ventures, Easton Hunt Capital, JAFCO Ventures, and H&Q Asia-Pacific. For more information, see www.sonicsinc.com
About Denali
Denali Software, Inc. is a world-leading provider of electronic design automation (EDA) software and intellectual property (IP) for system-on-chip (SoC) design and verification. Denali delivers the industry's most trusted solutions for deploying PCI Express, NAND and DRAM subsystems. Developers use Denali's EDA, IP and services to reduce risk and speed time-to-market for electronic system and chip design. Denali is headquartered in Palo Alto, California and has offices around the world to serve the global electronics industry. More information about Denali, its products and services is available at http://www.denali.com.
|
||||||
Related News
- Sonics-Denali Alliance Offers High Performance Memory System For Complex SOC Designs
- Movellus Launches Maestro Intelligent Clock Network Platform for SoC Designs
- Synopsys to Enable New Levels of Insight into SoC Designs and Systems with Industry's First Silicon Lifecycle Management Platform
- Sonics Partners With SiFive To Support Agile RISC-V SoC Design Platform With IP Industry's Most Widely Used NoCs
- NetSpeed launches SoCBuilder - AI-powered design and integration platform to accelerate SoC designs
Breaking News
- Ubitium Debuts First Universal RISC-V Processor to Enable AI at No Additional Cost, as It Raises $3.7M
- TSMC drives A16, 3D process technology
- Frontgrade Gaisler Unveils GR716B, a New Standard in Space-Grade Microcontrollers
- Blueshift Memory launches BlueFive processor, accelerating computation by up to 50 times and saving up to 65% energy
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
Most Popular
- Cadence Unveils Arm-Based System Chiplet
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Esperanto Technologies and NEC Cooperate on Initiative to Advance Next Generation RISC-V Chips and Software Solutions for HPC
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- Arteris Selected by GigaDevice for Development in Next-Generation Automotive SoC With Enhanced FuSa Standards
|
E-mail This Article | 
|
|
Printer-Friendly Page |