Lightspeed Logic collaborates with Cadence to deliver Reconfigurable Logic Reference Flow
CPF-Enabled Low-Power Reference Flow for Mask Reconfigurable Logic Enhances Design Flexibility and Manufacturability for SOC and ASSP Designs
San Jose, CA, June 1, 2007 - Lightspeed Logic, the leading provider of mask reconfigurable IP, today announced immediate availability of the 65-nanometer Common Power Format (CPF)-enabled reference flow for Lightspeed Logic’s Reconfigurable Logic IP. This reference flow enables SOC designers to accelerate time-to-market for low-power designs using Lightspeed Logic’s Reconfigurable Logic IP.
“We are pleased to collaborate with Cadence in the creation of this reference flow, delivering unparalleled quality of results to our mutual customers,” said Dave Holt, President and CEO, Lightspeed Logic. “Together with our Reconfigurable Logic, this flow allows customers to meet timing, signal-integrity, low-power requirements, and design-for-manufacturability objectives more rapidly, and with better quality of results than alternative solutions.”
SOC designers are now enabled to create a flexible chip architecture, significantly reducing design cost and speeding time-to-market. The lithography-aware routing in the reference flow coupled with the regular structure of the Reconfigurable Logic tile-based architecture helps reduce lithography related variability challenges at 65 nanometers and below. The reference flow is a complete flow from RTL to GDSII incorporating the CPF-based Cadence® Low Power Solution including design environments for logic synthesis, simulation, routing, functional verification, power optimization, timing and SI closure, and IR physical simulation coupled with Lightspeed Logic’s DesignBuilderTM tool, which is used for placement, mapping, clock tree synthesis, and buffering.
“We are pleased to work with Lightspeed Logic to add support of the Cadence Low Power Solution to their reference flow,” said Jan Willis, senior vice president of Industry Alliances at Cadence.“With the addition of Lightspeed Logic, ecosystem support for CPF continues to be the only proven solution and has the broadest list of industry support.”
Lightspeed Logic’s Reconfigurable Logic delivers a density and performance breakthrough for mask reconfigurable solutions, achieving 80 percent the density of traditional methodologies for multi-million gate logic blocks, twice the density of competing mask reconfigurable solutions.
Lightspeed Logic will introduce this flow at the Tech Talk titled "Reconfigurable Logic CPF Flow for Imaging, DTV and Basestation Applications" in the Cadence booth #2753 at the Design Automation Conference on Wednesday, June 6 from 10:30am to 11:00am, at the San Diego Convention Center.
About Lightspeed Logic
Lightspeed Logic is a provider of mask reconfigurable intellectual property (IP), a digital logic implementation technology that provides time-to-market, yield, manufacturability, and development expense advantages over standard-cell implementation. Founded in 1996, Lightspeed Logic has developed and brought to market four mask-reconfigurable architectures, the most recent of which is a regular logic structure available for multiple foundries, IDMs and process nodes. The company is currently working with customers at the 150, 90, 65, and 45 nm process nodes. Lightspeed Logic’s corporate headquarters are in Santa Clara, CA. You can find more information on Lightspeed Logic at www.lightspeed.com.
|
Related News
- Cadence Collaborates With Common Platform and Arm to Deliver 45-NM RTL-to-GDSII Reference Flow
- Cadence Collaborates with UMC to Deliver 65nm CPF-Based Low-Power Reference Design Flow
- UMC and Cadence Collaborate to Deliver 28nm Design Reference Flow for ARM Cortex-A7 MPCore-based SoC
- TSMC and Cadence Deliver 3D-IC Reference Flow for True 3D Stacking
- Synopsys and Virage Logic Collaborate on Test Reference Design Flow to Deliver Embedded Memory Test
Breaking News
- JEDEC® and Industry Leaders Collaborate to Release JESD270-4 HBM4 Standard: Advancing Bandwidth, Efficiency, and Capacity for AI and HPC
- BrainChip Gives the Edge to Search and Rescue Operations
- ASML targeted in latest round of US tariffs
- Andes Technology Celebrates 20 Years with New Logo and Headquarters Expansion
- Creonic Unveils Bold Rebrand to Drive Innovation in Communication Technologies
Most Popular
- Cadence to Acquire Arm Artisan Foundation IP Business
- AMD Achieves First TSMC N2 Product Silicon Milestone
- Why Do Hyperscalers Design Their Own CPUs?
- Siemens to accelerate customer time to market with advanced silicon IP through new Alphawave Semi partnership
- New TSN-MACsec IP core for secure data transmission in 5G/6G communication networks
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |