Melexis Collaborates with UMC to Deliver Chips for Automobile Applications
Rudi De Winter, CEO of Melexis: “Delivery of products with an embedded 0.18u flash processor is an important step for Melexis. It allows Melexis to fulfill the market needs for flexibility on integrated automotive systems on a chip.”
Henry Liu, senior vice president and head of the New Business Development Group at UMC, said, “Shipment of chips to Melexis' customers is a major milestone for everyone involved on this project, and is extremely rewarding due to the highly demanding and rigorous-quality demands that characterize the automobile industry.”
About Melexis
Melexis N.V. is a supplier of smart mixed-signal semiconductors. Our core experience derived from more than ten years supplying ICs to the automotive electronics market sustains the expansion into Application Specific Standard Products for industrial and consumer product applications. Melexis’ products include sensor ICs (Hall-effect, optical, infrared and Micro-Electro-Mechanical Systems or MEMS), communication ICs (low power RF, RFID and Automotive BUS), actuator ICs (for electric motors, solenoids and LEDs) and Application Specific Integrated Circuits (ASICs). Further information about Melexis can be found at http://www.melexis.com.
About UMC
UMC is a leading global semiconductor foundry that manufactures advanced process ICs for applications spanning every major sector of the semiconductor industry. UMC delivers cutting-edge foundry technologies that enable sophisticated system-on-chip (SoC) designs, including volume production 90nm, industry-leading 65nm, and mixed signal/RFCMOS. UMC's 10 wafer manufacturing facilities include two advanced 300mm fabs; Fab 12A in Taiwan and Singapore-based Fab 12i are both in volume production for a variety of customer products. The company employs approximately 13,000 people worldwide and has offices in Taiwan, Japan, Singapore, Europe, and the United States. UMC can be found on the web at http://www.umc.com.
|
Related News
- Cadence Collaborates with UMC to Deliver 65nm CPF-Based Low-Power Reference Design Flow
- UMC Collaborates with NTU to Deliver RF Chip for WiMax
- Andes Technology Collaborates with Lauterbach to Deliver RISC-V Trace Solution
- Nuclei System Technology collaborates with Siemens to deliver RISC-V Processor Trace Encoder solution
- Codasip collaborates with Siemens to deliver trace solution for custom processors
Breaking News
- intoPIX Powers Ikegami's New IPX-100 with JPEG XS for Seamless & Low-Latency IP Production
- Tower Semiconductor and Alcyon Photonics Announce Collaboration to Accelerate Integrated Photonics Innovation
- Qualcomm initiates global anti-trust complaint about Arm
- EnSilica Agrees $18m 7 Year Design and Supply ASIC Contract
- SiliconIntervention Announces Availability of Silicon Based Fractal-D Audio Amplifier Evaluation Board
Most Popular
- Qualcomm initiates global anti-trust complaint about Arm
- Siemens acquires Altair to create most complete AI-powered portfolio of industrial software
- Alphawave Semi Reveals Suite of Optoelectronics Silicon Products addressing Hyperscaler Datacenter and AI Interconnect Market
- EnSilica Agrees $18m 7 Year Design and Supply ASIC Contract
- Rapidus Announces Strategic Partnership with Quest Global to Enable Advanced 2nm Solutions for the AI Chip Era
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |