Melexis Collaborates with UMC to Deliver Chips for Automobile Applications
Rudi De Winter, CEO of Melexis: “Delivery of products with an embedded 0.18u flash processor is an important step for Melexis. It allows Melexis to fulfill the market needs for flexibility on integrated automotive systems on a chip.”
Henry Liu, senior vice president and head of the New Business Development Group at UMC, said, “Shipment of chips to Melexis' customers is a major milestone for everyone involved on this project, and is extremely rewarding due to the highly demanding and rigorous-quality demands that characterize the automobile industry.”
About Melexis
Melexis N.V. is a supplier of smart mixed-signal semiconductors. Our core experience derived from more than ten years supplying ICs to the automotive electronics market sustains the expansion into Application Specific Standard Products for industrial and consumer product applications. Melexis’ products include sensor ICs (Hall-effect, optical, infrared and Micro-Electro-Mechanical Systems or MEMS), communication ICs (low power RF, RFID and Automotive BUS), actuator ICs (for electric motors, solenoids and LEDs) and Application Specific Integrated Circuits (ASICs). Further information about Melexis can be found at http://www.melexis.com.
About UMC
UMC is a leading global semiconductor foundry that manufactures advanced process ICs for applications spanning every major sector of the semiconductor industry. UMC delivers cutting-edge foundry technologies that enable sophisticated system-on-chip (SoC) designs, including volume production 90nm, industry-leading 65nm, and mixed signal/RFCMOS. UMC's 10 wafer manufacturing facilities include two advanced 300mm fabs; Fab 12A in Taiwan and Singapore-based Fab 12i are both in volume production for a variety of customer products. The company employs approximately 13,000 people worldwide and has offices in Taiwan, Japan, Singapore, Europe, and the United States. UMC can be found on the web at http://www.umc.com.
|
Related News
- Cadence Collaborates with UMC to Deliver 65nm CPF-Based Low-Power Reference Design Flow
- UMC Collaborates with NTU to Deliver RF Chip for WiMax
- Andes Technology Collaborates with Lauterbach to Deliver RISC-V Trace Solution
- Nuclei System Technology collaborates with Siemens to deliver RISC-V Processor Trace Encoder solution
- Codasip collaborates with Siemens to deliver trace solution for custom processors
Breaking News
- Siemens delivers certified and automated design flows for TSMC 3DFabric technologies
- AheadComputing Raises $21.5M Seed Round and Introduces Breakthrough Microprocessor Architecture Designed for Next Era of General-Purpose Computing
- ZeroPoint Technologies Unveils Groundbreaking Compression Solution to Increase Foundational Model Addressable Memory by 50%
- Breker RISC-V SystemVIP Deployed across 15 Commercial RISC-V Projects for Advanced Core and SoC Verification
- Veriest Solutions Strengthens North American Presence at DVCon US 2025
Most Popular
- Intel in advanced talks to sell Altera to Silverlake
- S2C Teams Up with Arm, Xylon, and ZC Technology to Drive Software-Defined Vehicle Evolution
- Siemens to accelerate customer time to market with advanced silicon IP through new Alphawave Semi partnership
- Breker RISC-V SystemVIP Deployed across 15 Commercial RISC-V Projects for Advanced Core and SoC Verification
- Arteris Revolutionizes Semiconductor Design with FlexGen - Smart Network-on-Chip IP Delivering Unprecedented Productivity Improvements and Quality of Results
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |