Ericsson and Samsung sign telecom cross license deal
The parties have further agreed to dismiss all pending patent infringement lawsuits between the parties.
|
Related News
- Ericsson and Apple sign global patent license agreement, settle litigation
- Rambus and NVIDIA Sign Patent License Agreement
- SanDisk and Samsung Renew Patent Cross License and Flash Supply Agreements
- Samsung and Staktek Sign Expanded IP License Agreement
- NVIDIA and Intel Sign Broad Cross-License and Chipset License Agreements
Breaking News
- Cadence to Acquire Secure-IC, a Leader in Embedded Security IP
- Blue Cheetah Tapes Out Its High-Performance Chiplet Interconnect IP on Samsung Foundry SF4X
- Alphawave Semi to Lead Chiplet Innovation, Showcase Advanced Technologies at Chiplet Summit
- YorChip announces patent-pending Universal PHY for Open Chiplets
- PQShield announces participation in NEDO program to implement post-quantum cryptography across Japan
Most Popular
- Qualitas Semiconductor Signs IP Licensing Agreement with Edge AI Leader Ambarella
- BrainChip Provides Low-Power Neuromorphic Processing for Quantum Ventura's Cyberthreat Intelligence Tool
- Altera Launches New Partner Program to Accelerate FPGA Solutions Development
- Alchip Opens 3DIC ASIC Design Services
- Electronic System Design Industry Posts $5.1 Billion in Revenue in Q3 2024, ESD Alliance Reports
E-mail This Article | Printer-Friendly Page |