QUALCOMM and Exoteq Sign OFDM/OFDMA License Agreement
“This OFDM/OFDMA agreement will enable Exoteq to enhance its mobile broadband capabilities by offering solutions that incorporate QUALCOMM's patented OFDM/OFDMA technologies for multimedia content delivery to mobile handsets,” said Marv Blecker, president of QUALCOMM Technology Licensing. “QUALCOMM is pleased to work with Exoteq to enable new advanced mobile broadband devices in Finland initially, and eventually worldwide.”
“We are very pleased to now have access to QUALCOMM's extremely valuable patent portfolio for OFDM/OFDMA technologies and its FLASH-OFDM system is one of the first truly mobile broadband technologies available,” said Mr. Ilkka Martikainen, founder and CEO of Exoteq. “We have chosen to develop our first products using this technology and provide our customers with high-speed, low latency devices at affordable prices. FLASH-OFDM has already been commercially deployed on such a scale that the market size is viable for us. With this agreement, we are able to offer mobile VoIP, broadband Internet, email, instant messaging and streaming video and music on demand through our first product, the Exoteq Meos mobile broadband handset.”
Exoteq Aps (www.exoteq.com), founded in 2005, is a technology company developing high quality mobile broadband solutions. Exoteq's first products are handheld mobile broadband devices. Exoteq is an international group with extensive experience in high-tech communication, entertainment and consumer products. Currently, the company is represented in Denmark, Hong Kong and the UK. Exoteq is privately owned by its directors and SEED Capital K/S.
QUALCOMM Incorporated (www.qualcomm.com) is a leader in developing and delivering innovative digital wireless communications products and services based on CDMA and other advanced technologies. Headquartered in San Diego, Calif., QUALCOMM is included in the S&P 500 Index and is a 2007 FORTUNE 500® company traded on The Nasdaq Stock Market® under the ticker symbol QCOM.
|
Related News
- Qualcomm and GlobalWireless Sign 3G Femtocell License Agreement
- QUALCOMM and Continental Sign CDMA2000 Telematics Module License Agreement
- QUALCOMM and 4G Systems Sign WCDMA Modem Card and Router License Agreement
- DENSO and U.S. Startup Quadric Sign Development License Agreement for AI Semiconductor (NPU)
- GlobalFoundries and Qualcomm Sign Agreement to Deliver Advanced 5G RF Front-End Products
Breaking News
- Cadence to Acquire Secure-IC, a Leader in Embedded Security IP
- Blue Cheetah Tapes Out Its High-Performance Chiplet Interconnect IP on Samsung Foundry SF4X
- Alphawave Semi to Lead Chiplet Innovation, Showcase Advanced Technologies at Chiplet Summit
- YorChip announces patent-pending Universal PHY for Open Chiplets
- PQShield announces participation in NEDO program to implement post-quantum cryptography across Japan
Most Popular
- Alphawave Semi to Lead Chiplet Innovation, Showcase Advanced Technologies at Chiplet Summit
- Altera Launches New Partner Program to Accelerate FPGA Solutions Development
- Electronic System Design Industry Posts $5.1 Billion in Revenue in Q3 2024, ESD Alliance Reports
- Breaking Ground in Post-Quantum Cryptography Real World Implementation Security Research
- YorChip announces patent-pending Universal PHY for Open Chiplets
E-mail This Article | Printer-Friendly Page |