QUALCOMM Begins Utilizing 45 Nanometer Semiconductor Process Technology
“QUALCOMM's synergistic relationship with strategic foundry partners continues to support our long history of technology innovation as we reach this milestone in leading-edge process technology,” said Behrooz Abdi, senior vice president and general manager for QUALCOMM CDMA Technologies. “We look forward to enabling new classes of products at 45 nanometers and beyond, which will evolve the role of wireless in everyday life to a new level for people around the world.”
QUALCOMM has taped out its product on a low power-optimized 45 nm process that utilizes advanced immersion lithography and very low k inter-metal dielectrics features. The technology provides competitive performance with significant cost efficiency, along with improved performance on leakage and integration. The Company has also begun development work on 40 nm process technology, which is expected to deliver even greater benefits in semiconductor performance, cost and efficiency.
Close collaboration with strategic technology and foundry partners is a key part of QUALCOMM's Integrated Fabless Manufacturing (IFM) business model, which delivers greater efficiencies and accelerated technology advancement to the industry.
QUALCOMM Incorporated (www.qualcomm.com) is a leader in developing and delivering innovative digital wireless communications products and services based on CDMA and other advanced technologies. Headquartered in San Diego, Calif., QUALCOMM is included in the S&P 500 Index and is a 2007 FORTUNE 500® company traded on The Nasdaq Stock Market® under the ticker symbol QCOM.
|
Related News
- Samsung Announces Industry-First 45 nanometer Embedded Flash Logic Process Development
- Samsung and Intrinsity Jointly Develop the World's Fastest ARM Cortex-A8 Processor Based Mobile Core in 45 Nanometer Low Power Process
- Synopsys IC Compiler Routing Qualifies for TSMC's 45-Nanometer Process
- Texas Instruments new process techniques solve low-power challenges in delivering company's first 45 nanometer wireless device
- Synopsys Selected to Develop 45-Nanometer USB PHY IP for IBM Foundry Process
Breaking News
- GUC Joins Arm Total Design Ecosystem to Strengthen ASIC Design Services
- QuickLogic Announces $6.575 Million Contract Award for its Strategic Radiation Hardened Program
- Micon Global and Silvaco Announce New Partnership
- Arm loses out in Qualcomm court case, wants a re-trial
- Jury is out in the Arm vs Qualcomm trial
Most Popular
- Arm loses out in Qualcomm court case, wants a re-trial
- Micon Global and Silvaco Announce New Partnership
- Jury is out in the Arm vs Qualcomm trial
- Alphawave Semi Scales UCIe™ to 64 Gbps Enabling >20 Tbps/mm Bandwidth Density for Die-to-Die Chiplet Connectivity
- QuickLogic Announces $6.575 Million Contract Award for its Strategic Radiation Hardened Program
E-mail This Article | Printer-Friendly Page |